X-FAB to Exhibit Foundry Solutions for Designers of Power Electronics at APEC Conference and Exposition

Palm Springs, Calif., Feb. 17, 2010. X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, will present its high-performance power management solutions in 0.18, 0.35 and 0.6 micron technologies, in Booth #539 at the APEC Conference and Exposition, Palm Springs, Calif., Feb. 21-25, 2010. These solutions are ideal for applications such as precision analog, light source driving, sensor front ends, battery management and mixed-signal SoCs. X-FAB also will discuss its new modular Bipolar CMOS DMOS (BCD) process – XHB06 – optimized for applications requiring operating voltages up to 30V. With only 13 mask layers in the baseline process, it addresses customer needs for smaller chip area, less design effort, more flexibility and faster time-to-market. The XHB06 process is ideal for power management, radio frequency (RF) circuits and high-precision mixed analog/digital applications in telecommunications, consumer electronics, automotive and industrial products. 

WHO:              

Anyone involved in the design, development or manufacture of power electronics systems and products

WHAT:            

X-FAB’s power management technology offerings

WHEN: 

Monday February 22, 2010, 5 – 8 p.m.

Tuesday February 23, 2010, Noon – 5 p.m.

Wednesday February 24, 2010, 10:30 a.m. – 2 p.m.

WHERE:

Palm Springs Convention Center, California

Booth #539

WHY: 

Learn more about X-FAB’s technologies and comprehensive design support and enjoy technical discussions with semiconductor experts. 

About X-FAB

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany), Lubbock, Texas (US) and Kuching, Sarawak (Malaysia), and employs approximately 2,500 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.18 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.