Archives: Articles
-
NEC Electronics Europe Releases New 78K0 Lighting Communications Demonstration Kit
DÜSSELDORF (Germany), January 14, 2010 — NEC Electronics Europe today announced the release of the 78K0 Lighting Communications demonstration kit, enabling lighting ballast designers to adopt…
-
VIA Debuts World’s First USB 2.0 Audio Controller
Taipei, Taiwan, January 14, 2010 – VIA Technologies, Inc., a leading provider of PC and prosumer audio silicon, today unveiled the VIA Vinyl Envy VT1730 USB 2.0…
-
Agilent Technologies’ SystemVue Selected by Yamagata University for OFDM for Optical Fiber Communications Research
SANTA CLARA, Calif., Jan. 13, 2010 — Agilent Technologies Inc. (NYSE: A) today announced that Yamagata University in Japan, has selected Agilent’s SystemVue software for use in…
-
Mentor Graphics Delivers Hardware-Assisted Solution for the Accelerated Verification of USB 2.0 Products
WILSONVILLE, Ore.–(BUSINESS WIRE)–Mentor Graphics Corp. (NASDAQ:MENT), the leader in high-performance system verification solutions, today announced a hardware-assisted solution to accelerate the verification of Universal Serial…
-
Agilent Technologies Introduces 12-GHz Differential Wafer Probing Solution for Better Signal Integrity
SANTA CLARA, Calif., Jan. 13, 2010 — Agilent Technologies Inc. (NYSE: A) today introduced a 12-GHz differential wafer probing solution. The fine-wire probe tip is a high-fidelity,…
-
Industry’s Biggest, Highest Performance FPGA Now Shipping from Xilinx
SAN JOSE, Calif., Jan. 12, 2010 – Xilinx, Inc. (NASDAQ: XLNX) today announced the first shipments and availability of its Virtex®-6 LX760 device. As the…
-
Dialog Semiconductor Power Management IC selected by LG for Android Smartphone
Kirchheim/Teck, 11th January 2010 – Dialog Semiconductor plc (FWB: DLG), a leading provider of highly integrated innovative power management semiconductor solutions, has announced its DA9035…
-
ADLINK Announces COM Express® Module with Intel® Core™ i7 / i5 Processor featuring Integrated Graphics and Memory Controller
San Jose, Calif, January 12, 2010 – ADLINK Technology, Inc., a global provider of trusted embedded products, presented the Express-CB, the newest and most powerful member of the ADLINK…
-
SMART Modular Technologies Expands Lineup of DDR3 High Density, Small Modules for Networking, Telecom, Storage, and Industrial Applications
NEWARK, Calif., January 12, 2010-SMART Modular Technologies (WWH), Inc. (“SMART” or the “Company”) (NASDAQ: SMOD), a leading independent manufacturer of memory modules and solid-state storage…
-
Synopsys announces DesignWare Protocol Analyzer for verification of SuperSpeed USB 3.0-based designs
MOUNTAIN VIEW, Calif. – January 13, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing,…