Archives: Articles
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Lattice Updates Software Design Tools For Hot Swap Control and Power Management
– PAC-Designer 5.2 Tools Support New Power Manager II Devices; Ideal for Integrated Hot Swap Control, Supervision and Sequencing; Adds HDL Verification to Flow – HILLSBORO,…
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SP Devices interleaving technology used in Texas Instruments’ new 12-bit ADC evaluation module
Linköping, Sweden, November 9, 2009 – SP Devices today introduced its second evaluation module (EVM) with Texas Instruments (TI). This new EVM combines TI’s fastest…
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Lattice Announces Improved Hot Swap Support For Power Management Devices
— New Feature Expands MOSFET Options for Hot Swap Designs — HILLSBORO, OR — NOVEMBER 9, 2009 — Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced…
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TEWS TECHNOLOGIES Introduces FPGA-Based 4 Channel High Speed Synch/Asynch Serial Interface
Halstenbek, Germany – November 6th, 2009 – TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous serial single…
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TEWS TECHNOLOGIES Introduces FPGA-Based 4 Channel High Speed Synch/Asynch Serial Interface
Halstenbek, Germany – November 6th, 2009 – TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous serial single…
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Synopsys chosen by Realtek as its primary EDA partner
MOUNTAIN VIEW, Calif., Nov. 5, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today…
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Digi-Key Corporation Launches Digi-Key Toolbar Version 2
Redesign based on customer feedback includes new customization features Thief River Falls, Minnesota (USA) — November 5, 2009 — Electronic components distributor Digi-Key Corporation, recognized…
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Digi-Key Corporation Launches Digi-Key Toolbar Version 2
Redesign based on customer feedback includes new customization features Thief River Falls, Minnesota (USA) — November 5, 2009 — Electronic components distributor Digi-Key Corporation, recognized…
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Low profile 1500 Watt AC/DC power supply suits industrial bulk power applications
XP Power announced today the HPU1K5 1500 Watt AC/DC power supply series aimed at a broad range of industrial applications that require bulk power within…
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Infineon and TSMC Extend Technology And Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications
NEUBIBERG, Germany and HSINCHU, Taiwan, R.O.C., Nov. 5 /PRNewswire-FirstCall/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Taiwan Semiconductor Manufacturing Company (TWSE: 2330,…