Category: Manufacturing
Manufacturing
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Metal Oxide Resists Lower Roughness
One of the huge challenges of advanced-node patterning is roughness. There are actually two flavors of this: line-edge roughness (LER) and line-width roughness (LWR). Almost…
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EUV Blasts through 100 W
The EUV barrier has been broken. And I found out right on the heels of yesterday’s EUV update – but too late to get it…
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More Common-Process MEMS
Last year we took a look at a couple of proposals for universal processes from Teledyne/DALSA and CEA-Leti that could be used to make many…
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DSA Update
The focus of the directed self-assembly (DSA) discussion at SPIE Advanced Litho has changed. In past years, it has felt more like the efforts were…
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Tree Frogs Help Graphene Grow
Growing high-quality graphene for use on wafers is hard. Chemical vapor deposition (CVD) is the favored approach, but no one has perfected the ability to…
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MEMS First Silicon Success
Some time back, AMFitzgerald and Silex, a MEMS consultancy and foundry, respectively, announced their “RocketMEMS” program in order to take steps to accelerate the notoriously…
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Going Expensive to Reduce Interposer Cost
Imec has been working 2,5D IC issues with a particular focus on optimizing costs and, in particular, test yields. Yields can take what might have…
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Why Is Plastic Package News?
A new device available in a plastic package. Big news! Wow, no one has ever done that before, right? In so many other cases, this…
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A Different Spin on Job Loss
In a discussion with Teledyne DALSA about their MIDIS MEMS process, we spent a few moments discussing how the ASIC die and the MEMS die…
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Laying n-Type Epi
Dopants used to be there just for their doping. But stress is now an important aspect as well, which means the dopant atoms must be…