There is a mega-trend throughout electronic engineering that is pushing us toward smaller and smaller components and printed circuit boards. In this episode of Chalk Talk, Tom Wolf from Nexperia and Amelia Dalton explore the benefits of a smaller package size for the SOT23. They investigate how new package sizes for this SMD can lower your BOM, decrease your board space, and more.
Click here for more information about Nexperia SOT23 Surface-Mounted Package Products
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