News – Page 11 – EEJournal

Infineon launches TEGRION™ SLI22 automotive security controller with post-quantum cryptography certified to Common Criteria EAL6+

Munich, Germany – 03 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the 28nm TEGRION™ SLI22, the latest innovation in automotive…

March 6, 2026

TANAKA Develops World’s First High-Performance Palladium Hydrogen Permeable Membrane Exhibiting High Hydrogen Purification Performance at Temperatures around 100 degrees C

TOKYO, Mar 5, 2026 – (JCN Newswire) – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company…

March 6, 2026

SEGGER delivers launch-day support for ST’s new STM32C5 microcontrollers

Monheim am Rhein, Germany — March 5, 2026 — The STM32C5 series is the newest edition to STMicroelectronics’s widely adopted STM32 family of microcontrollers. Arm® Cortex®-M33-based and general purpose…

March 6, 2026

Plug-and-Play GMSL Camera Adapters Turn NVIDIA Jetson Orin Dev Kits into Rugged Multi-Camera Vision Platforms

Hsinchu, Taiwan, March 5th, 2026 – oToBrite, a provider of Vision AI solutions for unmanned vehicles, off-highway machines, and robotics, today announced two plug-and-play GMSL2 camera enablement kits for NVIDIA Jetson Orin Nano and NVIDIA Jetson AGX…

March 6, 2026

Bosch Sensortec validated for use with Snapdragon Wear Elite to elevate wearable experiences

Bosch Sensortec’s high-performance BMP585 pressure sensor is validated for use with Qualcomm Technologies’ new Snapdragon Wear™ Elite Platform. The sensor delivers precise altitude data for…

March 6, 2026

Siemens expands semiconductor-based circuit protection portfolio, debuts circular soft starter

SENTRON Electronic Circuit Protection Device (ECPD) will soon be available with integrated Residual Current Monitoring function A three-phase ECPD version for high-voltage (400V) applications is…

March 5, 2026

Rohde & Schwarz enables rapid validation of next-gen Wi-Fi 8 networking platforms, including 5×5 MIMO capabilities

Using the advanced MIMO test capabilities of the CMP180 radio communication tester from Rohde & Schwarz, Qualcomm Technologies, Inc. successfully completed comprehensive validation and performance…

March 5, 2026

QSMP-15W module adds wireless connectivity to cost-optimised STM32MP1 MPU platform for IoT & Industry 4.0 applications

Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for cost-optimised embedded systems applications…

March 5, 2026

Marvell Extends ZR/ZR+ Leadership with Industry-first 1.6T ZR/ZR+ Pluggable and 2nm Coherent DSPs for Secure AI Scale-across Interconnects

SANTA CLARA, Calif. – March 5, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the expansion of its multi-generational ZR/ZR+ and…

March 5, 2026

SECO strengthens its collaboration with NXP through i.MX 95– based solutions at embedded world 2026

Arezzo, Italy – March 5, 2026 – SECO announces a strong focus on its NXP® Semiconductors-based solutions at embedded world 2026 (March 10–12, Nuremberg), underscoring…

March 5, 2026

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