Archives: News
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Navitas Redefines Reliability with Industry’s First Automotive ‘AEC-Plus’ Qualified SiC MOSFETs in HV-T2PaK Top-Side Cooled Package
TORRANCE, CA – May 5th, 2025 — Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and…
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Microchip launches sub-$1, dual-core AVR microcontroller for functional safety applications
Several microcontroller vendors used the time around Embedded World 2025 to introduce some truly interesting devices. I’ve already written about the TI MSPM0 microcontroller family…
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Infineon CoolMOS™ 8 superjunction MOSFET sets new standards for optimized systems performance in server applications from LITEON
Munich, Germany – 30 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides its 600 V CoolMOS™ 8 high-voltage superjunction (SJ) MOSFET…
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Automotive gate driver enables scalable and high-performance EV-powertrain designs
STMicroelectronics’ STGAP4S galvanically isolated automotive gate driver for SiC MOSFETs and IGBTs gives flexibility to control inverters of different power ratings featuring programmable protections and rich diagnostics…
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Alpha and Omega Semiconductor Introduces Gen3 1200V aSiC MOSFETs Designed to Maximize Efficiency in High Power Applications
SUNNYVALE, Calif., May 1, 2025 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap…
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Enterprises to Redefine Cyber Resilience with Rackspace and Rubrik
SAN FRANCISCO, April 30, 2025 — LIVE! from RSAC, Rubrik (NYSE: RBRK), a leading cybersecurity company, and Rackspace Technology® (NASDAQ: RXT), a leading end-to-end hybrid cloud and AI solutions company,…
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Vishay Intertechnology 1 Form A Solid-State Relays Offer Continuous Load Current to 5 A in Compact SOP-4 Package
MALVERN, Pa. — April 30, 2025 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new industrial-grade 1 Form A solid-state relays in the surface-mount SOP-4…
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SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
DRESDEN, Germany — April 30, 2025 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems…