Archives: News
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xMEMS Extends µCooling Fan-on-a-Chip Technology to AI Data Centers – Delivers First In-Module Active Cooling for High-Performance Optical Transceivers
Santa Clara, CA – April 29, 2025 – xMEMS Labs, Inc., the pioneer of monolithic MEMS-based solutions, today announced the expansion of its revolutionary µCooling…
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Smart Surfaces: A Powerless Solution to Multipath Signal Interference
Multipath interference disrupts wireless signals, causing issues like TV ghosting and fading. Now, researchers from Japan have developed a passive metasurface that overcomes traditional filtering…
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Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications
CHANDLER, Ariz., April 28, 2025 — The rapid growth of artificial intelligence (AI) is transforming data centers, creating an unprecedented demand for high-performance, secure, reliable and…
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New CompacFrame Optimized for Rapid Development of Rugged AI-Focused Applications
FREMONT, Calif., April 2025 – Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot…
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Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design
CHANDLER, Ariz., April 23, 2025 — Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To…