News – Page 14 – EEJournal

Infineon expands AURIX™ TC3x with 400 MHz option to add real-time compute headroom without a platform change

Munich, Germany – 3 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a 400 MHz performance class for its AURIX™ TC3x…

March 3, 2026

ASRock Industrial Launches the iEPF-11000S Series to Push AI Workloads beyond Limits

Taipei, Taiwan (Mar 3, 2026) ASRock Industrial announces the launch of the iEPF-11000S Series, a powerful Expandable Edge AIoT Platform engineered for next-generation edge AI…

March 3, 2026

Innatera and Byte Lab Announce Strategic Solution Partnership to Accelerate Deployable Neuromorphic Edge AI Systems

DELFT, NETHERLANDS – March 3, 2026 – Innatera, the leader in neuromorphic processors for the sensor edge, today announced Byte Lab as a new solution…

March 3, 2026

Consortium to Build Quantum-Enabled ‘Brain-on-Chip’ Platform for Neurological Drug Discovery and Screening

Melbourne, Australia – March 3, 2026 – Chromos Labs, Tessara Therapeutics, Quantum Brilliance, Axol Biosciences, and the University of Melbourne today announced a consortium to develop a quantum-enabled brain-on-chip platform that measures real-time electrical activity from…

March 3, 2026

Innoviz Technologies Expands Partnership with Dataspeed Inc. to Integrate InnovizSMART LiDAR to Drive-by-Wire Platforms

Tel Aviv, ISRAEL – March 3, 2026 – Innoviz Technologies Ltd. (Nasdaq: INVZ) (the “Company” or “Innoviz”), a leading supplier of high-performance LiDAR solutions, and Dataspeed Inc. a premier…

March 3, 2026

e‑peas to showcase a simplified path to powering the Ambient IoT at Embedded World: Booth #4A 301

Louvain-la-Neuve, Belgium, 3rd March 2026 – e‑peas, a pioneer in ultra-low-power energy harvesting power management technologies, will showcase its range of PMIC technologies at Embedded World. These…

March 3, 2026

TDK to highlight innovative solutions shaping current and future power electronics technology at APEC 2026

TDK Showcases solutions for multiple applications including automotive, energy systems, solid-state transformers, optical solutions, data center, robotics and more TDK will be at booth #1419, March 23-25,…

March 3, 2026

Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 Eval Board at Embedded World 2026, Germany

Chesham, UK — March 03, 2026 — Sundance Multiprocessor Technology Ltd (Sundance), a leading provider of PC add-in boards and modules for embedded processing applications, will feature…

March 3, 2026

TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE™ Preforms”

Tokyo, Japan, March. 3, 2026 – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd., a company engaged in the industrial precious metals business of TANAKA, today announced a gold…

March 3, 2026

Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices

Key Highlights Synopsys helps Innatera design chips that enable real-time, energy-efficient AI processing at the edge, catalyzing the development of next-generation applications in physical AI…

March 2, 2026

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