Archives: News
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NanoIC opens access to first-ever fine-pitch RDL and D2W hybrid bonding interconnect PDKs
LEUVEN (Belgium), MARCH 2, 2026 — Today, the NanoIC pilot line, a European initiative coordinated by imec and dedicated to accelerating innovation in chip technologies…
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Rohde & Schwarz demonstrates FR1–FR3 carrier aggregation, advancing 6G readiness
Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1 and…
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Danisense achieves full ISO/IEC 17025 accreditation for AC calibration services
Key points: Danisense achieves full ISO/IEC 17025 accreditation for AC calibration services In-house calibration laboratory now fully accredited for AC and DC calibration Fast Turnaround…
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Shimadzu Introduces the TOC-1000e S On-Line Analyzer for Ultrapure Water Monitoring in Semiconductor Manufacturing
COLUMBIA, Md. (March 2, 2026) — Shimadzu Scientific Instruments introduces the TOC-1000e S on-line total organic carbon (TOC) analyzer, engineered to meet the increasingly stringent…
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Flex Announces U.S. Manufacturing Collaboration with AMD to Accelerate Domestic AI Infrastructure
AUSTIN, Texas, March 2, 2026 /PRNewswire/ — Flex (NASDAQ: FLEX) today announced the expansion of its strategic collaboration with AMD to manufacture the AMD Instinct platform in the United States, marking a…
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Imec unlocks lever for EUV dose reduction: oxygen injection during metal-oxide resist post-exposure bake emerges as game-changer for throughput
[SUMMARY] Imec demonstrates improved metal-oxide resist (MOR) performance when oxygen concentration is raised above atmospheric levels during the EUV lithography post-exposure bake step. This marks…