News – Page 18 – EEJournal

Marvell to Showcase Latest AI Data Center Connectivity Solutions at DesignCon 2026

SANTA CLARA, Calif. – February 24, 2026 – Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced it will showcase its latest data center…

February 24, 2026

Renesas R-Car V4H ADAS SoC Selected for Toyota RAV4 Model

Renesas ADAS automotive SoC, R-Car V4H has been selected for the TSS(LSS) control unit supplied by Denso for Toyota’s new RAV4 model R-Car V4H performs…

February 24, 2026

MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive

BRIDGEWATER, N.J., Feb. 24, 2026 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today announced…

February 24, 2026

Bourns Latest RF Inductors Deliver High Reliability from Advanced Multilayer Technology and Monolithic Construction

RIVERSIDE, Calif., February 23, 2026 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today introduced four Multilayer Chip Inductor…

February 23, 2026

Socionext and Innatera Introduce Integrated 60 GHz FMCW Radar and Neuromorphic Edge AI for Human Presence Detection

[Langen/Germany, Yokohama/Japan. February 23, 2026] – Socionext and Innatera today announced a jointly developed human-presence detection solution that combines 60 GHz FMCW radar sensing with neuromorphic…

February 23, 2026

Rohde & Schwarz highlights its comprehensive embedded systems test solutions at embedded world 2026

Embedded systems are fundamental to modern electronics, encompassing everything from power input and control PCBs to motors, sensors and user interfaces. Each of these comes…

February 23, 2026

SEGGER Receives ISO 27001 Certification, Strengthening Information Security and Customer Trust

Monheim am Rhein, Germany — February 20, 2026 — Information security is a long-standing priority at SEGGER, guiding the protection of intellectual property and the responsible handling of customer…

February 23, 2026

Taara Unveils Photonics Platform for Wireless Communication, and Taara Beam, Latest Product in Taara’s Portfolio and First on the New Photonic Core

Sunnyvale, CA – February 23, 2026 – Taara, a graduate of X, Google’s Moonshot Factory, today announced a breakthrough approach to commercial communications and connectivity infrastructure,…

February 23, 2026

New KYOCERA AVX Capacitors for Optical Communications

KYOCERA AVX expanded its selection of 550/560 Series ultra-broadband capacitors to better satisfy surging demand for high-speed, high-bandwidth optical communication systems in a steadily growing…

February 23, 2026

TDK introduces two new DC link capacitor series optimized for on-board chargers in electric vehicles

February 19, 2026 TDK Corporation (TSE: 6762) introduces the new B43655 and B43656 series of aluminum electrolytic capacitors designed specifically for DC links in on-board chargers…

February 20, 2026

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