Archives: News
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Official Launch of eXRP™, a Real-time 3D Engine for Industries
Tokyo, Japan, 1 April 2026 – eSOL, a leading developer of real-time embedded software solutions, will officially launch the industry’s first ever real-time 3D engine known…
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Samtec Offers Upscreen Testing to Speed Mil/Aero Time to Market
March 31, 2026 [New Albany, IN] — Samtec, Inc., the service leader in the connector industry, now offers in-house Upscreen Testing services to meet the highest…
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Mouser Now Shipping Microchip Technologies PIC32CM PL10 Arm Cortex -M0+ Based Microcontrollers for Industrial, Smart, and Consumer Applications
March 31, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new…
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EnSilica joins UK CHERI Adoption Collective to accelerate secure-by-design silicon
Oxford, UK, March 31st, 2026: EnSilica, a leading maker of mixed-signal ASICs, has been selected to join the newly formed CHERI Adoption Collective, launched by…
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STMicroelectronics’ low-resistance MOSFETs save energy and PCB area in power distribution applications
Geneva, Switzerland, March 31, 2026 — STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction…
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Infineon launches industry‑first TLVR quad‑phase module exceeding 2 A/mm² for next‑generation AI compute
Munich, Germany – 26 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) unveils a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage…
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HEAPGrasp: A Faster, Smarter Way for Robots to Handle Tricky Objects Using Only RGB Camera
The fields of manufacturing, logistics, and even restaurants are increasingly moving toward automation, with robots being employed for a wide range of tasks. One of…
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Fujitsu develops high-sensitivity, high-resolution infrared sensor to expand monitoring capabilities in defense and disaster prevention
KAWASAKI, Japan, Mar 27, 2026 – (JCN Newswire) – Fujitsu today announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities…
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QSMP-20 module utilises DDR3 memory to avoid ongoing AI pressure on lead times and cost
Oxfordshire, UK, March 2026: Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for the new QSMP-20 solder-down QFN-style SoM (system-on-module),…
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Bourns Expands SSA-2 Series Analog Current Sensors with AEC-Q Compliant Assembly Option
RIVERSIDE, Calif., March 30, 2026 – Bourns today announced that its SSA-2 Series analog current sensors are now available with an AEC-Q compliant components assembly option. The addition…