News – Page 20 – EEJournal

Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size

MALVERN, Pa. — Feb. 18, 2026 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified thick film chip resistors in the…

February 18, 2026

Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

Scalability and functional safety enabled by chiplet technology Auto-grade quality for large, modern AI NPUs Advanced power control for higher performance, improved power efficiency and…

February 18, 2026

NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More

February 17, 2026 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new energy-efficient i.MX 91 applications…

February 18, 2026

Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025

ROCKVILLE, MD., – February 17, 2026 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the smart edge, today announced that 2025…

February 18, 2026

Imec unveils 7‑bit, 175GS/s massively time-interleaved slope- ADC – pairing record-small footprint and low conversion energy with top sampling speed

At IEEE ISSCC 2026, imec introduces a 7-bit, 175GS/s wireline ADC implemented in 5nm FinFET technology, combining a record-small footprint (250 x 250µm²) and low…

February 17, 2026

STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules

Geneva, Switzerland, February 17, 2026 — STMicroelectronics’ STGAP2SA and STGAP2HSA automotive-grade, galvanically isolated 4A gate drivers with 60ns response time and close part-to-part matching allow high switching frequencies for increased…

February 17, 2026

Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands

Compression-based, on-substrate connector and cable assembly optimize signal integrity and efficient power distribution at speeds of 224Gbps PAM-4 and beyond Impress leverages insights and engineering…

February 17, 2026

Archives: News

Vishay Intertechnology AEC-Q200 Qualified Thick Film Chip Resistors Feature Ultra Compact 0201 Case Size

Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era

NXP Semiconductors i.MX 91 Processors, Now Available from Mouser Electronics, Support IoT, Edge, Smart Home, Industrial Applications, and More

Ceva Highlights Breakthrough Year for AI Licensing and Physical AI Adoption in 2025

Imec unveils 7‑bit, 175GS/s massively time-interleaved slope- ADC – pairing record-small footprint and low conversion energy with top sampling speed

STMicroelectronics’ fast-acting isolated gate drivers for smaller, safer automotive modules

Molex Launches Impress Co-Packaged Copper Solutions, Scaling Near-ASIC Connectivity Innovations to Meet Next-Generation Data Rate Demands

TDK launches high‑reliability automotive NTC thermistors rated for +175 °C

Abaco’s New Fiber Optic Module Improves Data Intelligence Delivery Speeds

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs