Archives: News
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High Efficiency ±6A Switching Regulator for DDR Termination Complies with DDR/DDR2/DDR3 Standards
MILPITAS, CA – July 7, 2011 – Linear Technology Corporation introduces the LTC3617, a high efficiency, monolithic synchronous step-down switching regulator, capable of generating a bus…
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SPIRIT DSP Signs Fifth Licensing Agreement with Polycom
MOSCOW, Russia – July 7, 2011 – SPIRIT DSP, the world’s top voice and video over IP engines provider, has announced today that it has signed its…
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ZMDI ZSSC3008 Sensor Signal Conditioner IC for Automotive, Industrial Automation and White Goods Applications
Dresden, Germany – July 7, 2011 — ZMD AG, a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, and medical applications, has introduced…
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60V Current Sense Amplifier Offers Adjustable Fault Flags
MILPITAS, CA – July 6, 2011 – Linear Technology announces the LT6109, a complete high side current sense device that incorporates a current sense amplifier, dual…
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Xilinx ISE Design Suite 13.2 Steps up Designer Productivity and Brings Partial Reconfiguration to Kintex-7, Virtex-7 FPGAs
SAN JOSE, Calif., July 6, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today released ISE® Design Suite 13.2, providing support for the 28nm 7 series families including the…
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Pickering Interfaces Expands Range of Fault Insertion PXI Modules
Clacton on Sea, UK, July 5th 2011 –Pickering Interfaces is expanding its range of PXI Fault Insertion solutions with the introduction of the 40-197 and the…
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Cortus APS3 Processor at the Heart of PointChips Touch Screen Controller Chip
July 6th 2011 – PointChips, a South Korean company, has included the Cortus APS3 32 bit processor in their touch screen controller chip. The APS3…
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Mass-market proximity sensing and security is available now with finalization of Bluetooth low energy Find Me and Proximity profiles
The ability to find missing keys and smartphones, or alarm and securely lock almost any portable device that is separated from its owner, will be…
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Baolab uses its NanoEMS technology to create ultra-low cost 3D Digital MEMS Compasses in CMOS
Barcelona, Spain – 5 July 2011. Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic…
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CEVA Enhances its CEVA-XC DSP Product Offering With HSPA+ Software IP
MOUNTAIN VIEW, Calif. – July 06, 2011 – CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP…