News – Page 2231 – EEJournal

Ericsson 3E digital voltage-regulators now support 93 PMBus commands to reduce energy consumption

More freedom for designers to dynamically optimize energy management Increased efficiency with fewer components Fully compliant with PMBus commands Design simplified; time-to-market reduced Based on…

June 17, 2011

Agilent Technologies’ N6700 Modular Power System Family Adds Application-Specific Modules for Battery Test, Mobile Device Manufacturing

SANTA CLARA, Calif., June 15, 2011 – Agilent Technologies Inc. (NYSE: A) today announced the addition of two new application-specific modules to the N6700 Modular Power System…

June 17, 2011

Agilent Technologies Introduces First Modular AXIe Embedded Controller

SANTA CLARA, Calif., June 16, 2011 – Agilent Technologies Inc. (NYSE: A) today announced the first modular AXIe embedded controller – the Agilent M9536A, a powerful one-slot…

June 17, 2011

Cascade Microtech Integrated Probe Systems Speed Time-to-Market for Growing Power Device Segment

BEAVERTON, OR–(Marketwire – Jun 16, 2011) – Cascade Microtech, Inc. (NASDAQ: CSCD), a leading expert at enabling precision measurements of integrated circuits at the wafer level,…

June 17, 2011

Telit Touts EV-DO M2M Module Ideal For Commercial and Consumer Applications

Raleigh, NC – June 15, 2011 – Telit Wireless Solutions, Inc., the U.S.-based mobile technology arm of Telit Communications (AIM: TCM), announced today the debut of…

June 17, 2011

Rugged+ TFT displays for demanding applications

Maidenhead, UK, 16 June 2011. Hitachi DPG (Display Products Group) has announced the introduction of a new line-up of Rugged+ TFT LCD display modules specifically…

June 17, 2011

KEMET Introduces High Voltage Ceramic Capacitors for the Automotive Industry

KEMET has announced the introduction of its new Automotive Grade High Voltage Multilayer Ceramic Capacitors. Qualified to the Automotive Electronics Council’s AEC-Q200 standard, these surface…

June 17, 2011

IAR Systems Collaborates with Qualcomm Atheros in Bringing to Market the Industry’s First Wi-Fi System-in-Package Development System

Foster City, CA—June 16, 2011—IAR Systems® today announced its collaboration with Qualcomm Atheros on its new AR4100 solution, a highly integrated, Wi-Fi system-in-package (SIP) for…

June 17, 2011

Agilent Technologies Advances X-Parameters* Innovations

SANTA CLARA, Calif., June 8, 2011 – Agilent Technologies Inc. (NYSE: A) today announced the latest wave of X-parameter innovations designed to further advance their use and support the…

June 16, 2011

Avnet Electronics Marketing Americas Takes Thermal Solutions to the Nextreme

PHOENIX—June 16, 2011 — Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), has inked a distribution agreement with Nextreme Thermal Solutions, a manufacturer of…

June 16, 2011

Archives: News