News – Page 2267 – EEJournal

SystemC AMS DAY, May 12, Dresden, Germany

SAN JOSE, CA–(Marketwire – Apr 28, 2011) – The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to supporting and advancing SystemC™ as an…

April 28, 2011

DiSTI Expands Visual Interface Bundle for Embedded Systems (VIBE)

ESC SILICON VALLEY, San Jose, California (April 28, 2011) – The DiSTI Corporation, a leading provider ofhuman machine interface (HMI) development tools for high reliability…

April 28, 2011

Alliance Memory Introduces New Line of High-Speed CMOS Synchronous DRAMs With 64-Mb, 128-Mb, and 256-Mb Densities in TSOP II Package

SAN CARLOS, CA–(Marketwire – Apr 27, 2011) – Alliance Memory, Inc., a worldwide provider of legacy memory ICs for the communications, computing, industrial, and consumer markets,…

April 28, 2011

Archives: News

SystemC AMS DAY, May 12, Dresden, Germany

DiSTI Expands Visual Interface Bundle for Embedded Systems (VIBE)

Alliance Memory Introduces New Line of High-Speed CMOS Synchronous DRAMs With 64-Mb, 128-Mb, and 256-Mb Densities in TSOP II Package

BlueRadios® and Stonestreet One Deliver Bluetooth® 4.0 Dual Mode Low Energy Module

Murata Power Solutions extends its range of 25W low-profile open-frame DC-DC converters

RECOM Power and Mouser Create Global Distribution Initiative

NXP Announces CGVxpress High Speed Serial Interface

Accellera Announces IP Tagging Effort, Calls for Participation

FreeRTOS Seven unveiled for ESC San Jose

Green Hills Software to Present and Exhibit at Embedded Systems Conference Silicon Valley 2011