News – Page 2307 – EEJournal

RFMD® Unveils Power Platform for Entry-Level 3G Handsets

Barcelona, Spain, February 14, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components…

February 21, 2011

First Qseven Module with NVIDIA Tegra290 ARM CPU

Stutensee, Germany – With the MSC Q7-NT2, MSC Vertriebs GmbH presents its first ARM® processor based Qseven™ module. The compact module consumes only 5 W typical…

February 21, 2011

Advantech Announces New ATCA Platform Integration Services To Accelerate Network Solutions Development

Irvine, California, February 18, 2011 – Advantech, a global manufacturer of telecom computing blades and multi-core network processor platforms, today announced new ATCA Platform Integration Services at…

February 21, 2011

Space-saving socket option for energy friendly microcontrollers

Oslo, Norway, February 21, 2011 – Energy Micro, the energy friendly microcontroller company, has announced it is making its EFM32 Gecko and Tiny Gecko product…

February 21, 2011

Meggitt Sensing Systems Introduces High-Temperature Accelerometer to +482°C with Three-Point ARINC Mounting and Long MTBF

February 17, 2011, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco® model 6233C, a highly rugged, high-temperature piezoelectric…

February 21, 2011

High performance 600W cPCI from Gresham Power offers vendor, inventory and cost reduction

February 2011 – Gresham Power Electronics, the Salisbury based MIL and Commercial power conversion specialist, claim their 6U 600W cPCI power supply can cost effectively replace…

February 21, 2011

Vector Fabrics eases heterogeneous multicore development

Eindhoven, The Netherlands, February 21, 2011 Vector Fabrics today announced the launch of their vfEmbedded cloud-based tool that allows embedded engineers to partition and map…

February 21, 2011

RFMD® Introduces Power Amplifiers With Breakthrough Peak Efficiency

Barcelona, Spain, February 14, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components…

February 21, 2011

Agilent Technologies’ Latest 3D EM Simulation Platform Provides Faster, More Accurate Modeling of RF, High-Speed Components

SANTA CLARA, Calif., Feb. 16, 2011 – Agilent Technologies Inc. (NYSE:A) today announced Electromagnetic Professional 2011.02, a new release of its 3-D electromagnetic modeling and simulation platform for…

February 18, 2011

Step-Down Converter with Linear Bypass Powers Multimode PAs in Mobile Handsets

SUNNYVALE, CA—February 17, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX8989, a step-down converter designed to power PA (power amplifier) modules in mobile phones. The…

February 18, 2011

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