News – Page 32 – EEJournal

Infineon and HL Klemove collaborate to advance automotive innovation for software-defined vehicles

Munich, Germany – 8 January 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and HL Klemove have signed a Memorandum of Understanding (MoU)…

January 14, 2026

Innodisk Unveils the New “AI on Dragonwing” Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm’s SoC

Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc…

January 14, 2026

Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers

CHANDLER, Ariz., January 8, 2026 — Microchip Technology (Nasdaq: MCHP) has announced the release of custom-designed firmware for its MEC1723 Embedded Controller (EC), specifically tailored to support NVIDIA…

January 14, 2026

From Space to Earth: LYNRED launches an eSWIR sensor to better measure critical resources and climate signals

Grenoble, France, January 12, 2026 — As pressure mounts on access to critical raw materials, food security and climate data, the ability to accurately analyze…

January 13, 2026

SGET Shakes Up FPGA Market with World Premiere of oHFM: The Open Harmonized FPGA Module Standard

Munich, Germany – January 8, 2026 – The Standardization Group for Embedded Technologies e.V. (SGET) today announced a paradigm shift in embedded design with the official…

January 13, 2026

Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions

The certification validates Innodisk’s secure development lifecycle across its full product portfolio, aligning its edge AI and industrial solutions with international cybersecurity and regulatory requirements.…

January 13, 2026

NXP’s New UCODE X Delivers Industry-Leading RAIN RFID Performance for High-Volume Applications

What’s New: NXP Semiconductors today announced the new UCODE X, delivering industry-leading read and write sensitivity, flexible configurations, and the industry’s lowest power consumption. UCODE…

January 13, 2026

LambdaTest Rebrands to TestMu AI, the Agentic AI platform for Quality Engineering

SAN FRANCISCO, CALIFORNIA – January 12, 2026; LambdaTest, the AI-native, agentic quality engineering platform, today announced its rebrand to TestMu AI, marking a bold step forward…

January 12, 2026

Zapata and University of Maryland Collaborate to Advance New Paradigm in Quantum Software

Boston, Mass, January 12, 2026 — Zapata Quantum, Inc. (OTC: ZPTA) (“Zapata”, “Zapata Quantum” or the “Company”), a pioneer in quantum computing application and algorithm development,…

January 12, 2026

OMRON Launches P6K Sockets Compatible with G6K Relay Series to Simplify Assembly and Maintenance

HOFFMAN ESTATES, Ill.–(BUSINESS WIRE)–OMRON Electronic Components, a global leader in innovative component solutions, today announced the launch of its P6K relay sockets, a surface-mount connecting…

January 12, 2026

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