Archives: News
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Keysight Launches Software Solution to Ensure Trustworthy AI Deployment in Safety-Critical Environments
January 6, 2026 SANTA ROSA, Calif., – Keysight Technologies, Inc. (NYSE: KEYS) today introduced Keysight AI Software Integrity Builder, a new software solution designed to transform how AI-enabled…
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NXP Advances Edge AI Leadership with New eIQ Agentic AI Framework
New eIQ Agentic AI Framework enables autonomous agentic intelligence at the edge, adding a new pillar to NXP’s edge AI platform Brings agentic AI to…
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congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards
San Diego, CA, January 5, 2026 * * * congatec – a leading vendor of embedded and edge computing building blocks – today launched the industry’s broadest portfolio of…
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With TDK sensing solutions, Engo delivers augmented reality eyewear for performance athletics
InvenSense, a TDK Group company, partners with Engo, whose augmented reality glasses enhance athletic performance by placing real-time training stats within an athlete’s field of…
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Ambarella Launches a Developer Zone to Broaden its Edge AI Ecosystem
SANTA CLARA, Calif., Jan. 6, 2026 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced during CES the launch of its Ambarella Developer Zone (DevZone). Located…
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BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms
LAS VEGAS, NV. – CES 2026 – January 6, 2026  – As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor…
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Sixfab’s ALPON™ X5 AI Wins CES® 2026 Best of Innovation Award, Advancing Real-Time Physical AI at the Edge
DALLAS–FORT WORTH, Texas | January 6, 2026 — Sixfab announced that its ALPON X5 AI has been named a CES 2026 Best of Innovation Award winner in the Enterprise Tech category. The award, presented…
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Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026
Key Highlights Synopsys will support the Fédération Internationale de l’Automobile (FIA), the global governing body for motorsport and the federation for mobility organizations worldwide, to…
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SECO launches new COM Express Type 6 module featuring Intel Core Ultra Series 3 processors
Arezzo, Italy, January 6, 2026 — SECO announces the launch of the SOM-COMe-BT6-PTL, a new COM Express Type 6 module powered by new Intel Core Ultra Series 3…
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Siemens unveils technologies to accelerate the industrial AI revolution at CES 2026
Siemens and NVIDIA expand their partnership to build the Industrial AI Operating System, reinventing the entire end-to-end industrial value chain through AI – from design…