Archives: News
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3M to debut AI-powered assistant ‘Ask 3M’ and expanded 3M Digital Materials Hub at CES 2026
ST. PAUL, Minn., Dec. 29, 2025 /PRNewswire/ — 3M (NYSE: MMM) today announced two digital innovations that will accelerate customer design workflows: Ask 3M, a new AI-powered…
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2026 IEEE Electronic Components and Technology Conference Announces Student Innovation Challenge; Result Reports Must be Submitted by January 19, 2026
ORLANDO, FL (December 19, 2025) – The premier technical conference and product exhibition for the world’s semiconductor packaging industry, the IEEE Electronic Components and Technology Conference…
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Greenliant NVMe NANDrive™ SSDs Selected for Major Industrial, Aerospace and Mission Critical Programs
SAN JOSE, CALIF. – DECEMBER 22, 2025 – Greenliant has been sampling its high endurance, small form factor (16mm x 20mm) NVMe NANDrive™ EX Series…
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Ambarella Accelerates Edge AI Innovation for Next Generation of Drones; Antigravity Deploys Ambarella’s CV5 AI SoC in Antigravity A1 Drone
SANTA CLARA, Calif., Dec. 22, 2025 — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced in advance of CES its reaffirmed commitment…
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Chonnam National University Researchers Resolve Long-Standing Limitation in Thin-Film Solar Cells
Tin monosulfide (SnS) is a promising, earth-abundant material for thin-film solar cells, but device performance has long been limited by defects and unwanted reactions at…
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NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
MORRISVILLE, NC (DECEMBER 16, 2025) – NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, uniquely supports mixed-material hybrid bonding with either copper or nickel bonds.…