Archives: News
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Alchip and Ayar Labs Unveil Co-Packaged Optics for AI Datacenter Scale-Up
SAN JOSE, Calif. — Sept. 26, 2025 — At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Alchip Technologies, the high-performance ASIC leader, and…
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Reduce Infrastructure Costs and Extend Network Reach with ProLabs’ Coherent Transceiver Portfolio
ProLabs, a global leader in optical connectivity solutions, proudly announces its participation in the SCTE TechExpo25, taking place in Washington, D.C., from September 29 to…
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Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing
Key Highlights Ansys, part of Synopsys, created a digital twin racetrack for STEM Racing (formerly F1 in Schools) that enables students to virtually test aerodynamics…
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Compact Click dev tool from MIKROE delivers precise control of brushed DC motors in industrial and robotic applications
September 2025: DC Motor 31 Click is a compact add-on board designed to drive brushed DC motors providing precise control, torque adjustment, and fault monitoring for a…
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Turning Rust into Fuel: MANA Advances Green Rust Catalyst for Next-Gen Hydrogen Vehicles
TSUKUBA, Japan, September 25, 2025 / — Researchers from the Research Center for Materials Nanoarchitectonics (MANA), one of the centers under the National Institute for…
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French Team Led by CEA-Leti Develops First Hybrid Memory Technology Enabling On-Chip AI Learning and Inference
GRENOBLE, France, Sept. 25, 2025 – Breaking through a technological roadblock that has long limited efficient edge-AI learning, a team of French scientists developed the first…
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Siemens and ASE collaborate on workflows for ASE’s VIPack advanced packaging platform
Siemens Digital Industries Software today announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in…