News – Page 73 – EEJournal

Digital Twin Consortium Welcomes AMD to Accelerate AI-Powered Digital Twin Innovation at the Edge

BOSTON, MA and SANTA CLARA, CA – SEPTEMBER 17, 2025 – Digital Twin Consortium® (DTC) today announced that Advanced Micro Devices, Inc. (AMD) has joined as a member.…

September 18, 2025

Value-optimized power-management IC for automotive applications

The SPSA068 from STMicroelectronics is a compact, convenient, and cost-effective power-management IC (PMIC) for automotive applications. With configurable parameters and qualified to AEC-Q100, the SPSA068 supports ISO…

September 18, 2025

NEXCOM’s Rugged Edge AI Computer, ATC 3561-NA4C, for Smart Agriculture

New Taipei City, Taiwan – September 18th, 2025 – NEXCOM is pleased to announce a new, powerful and rugged Edge AI Computer, ideal for smart…

September 18, 2025

CEA-Leti to Present Breakthrough Toward Ultra-Compact, High-Resolution AR/VR Displays at MicroLED Connect Conference

GRENOBLE, France – Sept. 16, 2025 – CEA-Leti and the Centre for Research on Heteroepitaxy and its Applications (CRHEA) today announced R&D results that have cleared a path…

September 17, 2025

Siemens unveils groundbreaking Tessent AnalogTest software for automated analog circuit test generation

Siemens Digital Industries Software today introduced Tessent™ AnalogTest software – an innovative solution that reduces pattern generation time for analog circuit tests from months to…

September 17, 2025

TDK adds SmartMotion® for Smart Glasses to its custom sensing solutions for AI glasses and augmented reality

TDK’s advanced motion tracking IMU with an embedded machine learning solution enables responsive, motion context-aware smart eyewear for augmented reality and seamless AI accessibility in wearables…

September 17, 2025

Ethernet and AI Converge in Ethernet Alliance’s ECOC 2025 Demo

BEAVERTON, OR, Sept. 16, 2025 (GLOBE NEWSWIRE) — The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today announced…

September 17, 2025

Infineon expands XENSIV™ MEMS microphone lineup delivering best-in-class audio and power performance

Munich, Germany – 16 September 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has expanded its XENSIV™ MEMS microphone lineup with the introduction…

September 17, 2025

Tektronix redefines automated test with the MP5000 Series modular precision test system

Beaverton, Oregon – Tektronix today unveiled the MP5000 Series modular precision test system, a transformative solution that sets the pace for the future of automated test. Built…

September 17, 2025

Latent AI and Wind River Collaborate to Advance Edge AI for Mission-Critical Systems

PRINCETON, NJ and ALAMEDA, CA – Sep. 11, 2025 –Latent AI, a leader in edge AI solutions, and Wind River, an Aptiv company and global leader…

September 16, 2025

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