News – Page 8 – EEJournal

Axelera® AI Adds Kudelski Labs’ Security IP to Europa Chip to Enable Secure, High-Performance Edge AI

CHESEAUX-SUR-LAUSANNE, Switzerland, and PHOENIX (AZ), USA — March 10, 2026 — Kudelski Labs, the innovation arm of the Kudelski Group (SIX:KUD.S) and a global leader in embedded security for semiconductors and connected devices, today announced that Axelera AI…

March 11, 2026

IAR expands its embedded development platform with Long-Term Support (LTS) Services for safety-critical applications

Uppsala, Sweden – March 9, 2026 – IAR today announced the expansion of its Embedded Development Platform with new Long-Term Support (LTS) Services designed to…

March 11, 2026

BANF and Silicon Labs Digitize the “Last Analog Domain” with Intelligent Tire Monitoring Solution

Seoul, South Korea and Austin, TX — March 10, 2026 — BANF, a Korean intelligent tire system company, and Silicon Labs, the leading innovator in low-power…

March 11, 2026

Dukosi to Debut Novel Module-level Communication Solution using Near Field Wireless at Embedded World 2026

EDINBURGH, United Kingdom, 9 March, 2026 — Dukosi Ltd, the technology company revolutionizing the performance, safety and sustainability of high-power battery systems, introduces a novel…

March 11, 2026

The Advanced Packaging International Conference Program to Feature a Presentation from NHanced Semiconductors President Robert Patti on “Foundry 2.0” – a New Paradigm for Semiconductor Manufacturing

BRUSSELS, BELGIUM (MARCH 10, 2026) – At the first Advanced Packaging International Conference, NHanced Semiconductors president Robert Patti will present a talk entitled “Foundry 2.0: A…

March 11, 2026

MediaTek Adds New Genio Platforms to Bring AI Processing to Robotics, Drones, and Industrial IoT

NUREMBERG, GERMANY – March 10, 2026 – At Embedded World, MediaTek unveiled a range of new Genio platforms ideal for powering a wide variety of IoT…

March 11, 2026

TI expands microcontroller portfolio and software ecosystem to enable edge AI in every device

News highlights: TI’s integrated TinyEngine NPU can run AI models with up to 90 times lower latency and more than 120 times lower energy utilization per…

March 10, 2026

Infineon and Subaru collaborate to improve driver safety by enhancing real-time performance in advanced driver assistance systems

Munich, Germany, and Tokyo, Japan – 9 March 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Subaru Corporation are collaborating to enhance…

March 10, 2026

Microchip Expands Security Services in the Trust Platform to Help Manufacturers Meet Cybersecurity Regulations

CHANDLER, Ariz., March 10, 2026 — As cybersecurity regulations tighten worldwide, product manufacturers must embed security from the outset to meet compliance. To help developers address…

March 10, 2026

Morse Micro Launches Morse Micro Design Partner Program at Embedded World 2026

Embedded World 2026, Nuremberg – March 9, 2026 – Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today launched the Morse Micro Design Partner Program, a…

March 10, 2026

Archives: News