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Operation eVTOL: System Design Challenges for Electric Vertical Take-Off and Landing Aircraft
Matt McAlonis from TE Connectivity walks through the biggest electrical and mechanical design hurdles facing the next generation of urban air mobility.
Scaling Multi-Die Designs with Advanced Packaging
TSMC Breaks Ground on Second Arizona Fab Expansion
Low-Power MCUs for Always-On Sensing Applications
A deep dive with Silicon Labs on architecting battery-life-critical edge devices.
The 1-Bit LLM Claim Everyone’s Arguing About
White Paper: Verifying RISC-V Cores for Safety-Critical Markets
Automated, Certification-Level RISC-V Verification Coverage
Fish Fry: Inside the Chiplet Interconnect Wars
Amber Huffman joins the show to talk UCIe adoption and what comes after.
Next-Gen PCIe 7.0 Signal Integrity Demo
ARM Unveils New Automotive Reference Platform
Power Integrity in 3nm SoC Designs
Industry News
September 13, 2024
- VIAVI Drives Down Testing Complexity and Cost with Automation and Orchestration Platform
- Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology
- EP6 Quantum NetworkSM powered by Qubitekk hosts Oak Ridge National Laboratory’s first run on a commercial quantum network
- Mouser Electronics Explores Sustainable Smart Grid Innovation in Latest Content Series
- Verisole and Peridio Partner to Accelerate Development of Edge AI Devices
September 12, 2024
- Functional Safety Certification for Microchip’s PolarFire FPGAs Speeds Time to Market
- Requirements & Systems Portal Application Now Available on the Altium 365 Cloud Platform
- Alliance Memory Single-Channel 16Gb LPDDR4X SDRAM Combines Low-Voltage Operation of 0.6V With Fast Clock Speeds
- Newark Enhances Sensor Measurement with Free Data Logging Software and CompactDAQ Hardware
- PLS and GLIWA announce the Integration of the UDE Universal Debug Engine into GLIWA T1.timing
September 11, 2024
- Melexis introduces digital output Triphibian pressure sensor
- New programmable resistor modules from Pickering Interfaces address both functional test & verification and HIL applications
- Rethink Robotics Launches Detachable Mobile Manipulator Robot at IMTS 2024
- Synopsys Advances Imaging System Development with Industry’s First Complete Virtual Prototyping Platform
- TDK expands Inline structure and low-resistance type MEGACAP MLCCs with metal frames for automotive
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No Slacking! Put Your Semicolons to Work
So, here goes: 1) There is no way to increase performance meaningfully using edge triggered flip-flops. Clock frequency, skew, and heat dissipation …
No Slacking! Put Your Semicolons to Work
Boy! I mangled that! I cannot believe that some one familiar with the TTL Data Book could write that. Right up front they say the limits are whatever they …
The Moon Needs Its Own Time Zone. Relativity Says It Also Needs Its Own Clocks
Next time I’m reaching for a headline, Tactus, …
Featured Articles
Operation eVTOL: System Design Challenges for Electric Vertical Take-Off and Landing Aircraft
This week’s podcast is all about electric vertical take-off and landing aircraft! Matt McAlonis from TE Connectivity and I explore the biggest design …
Want Automated, Certification-Level RISC-V Verification Coverage?
I feel like an old fool (but where are we going to find one at this time of the day?). Almost everything I hear on the technology front these days causes me …
Is Jeff Goldblum Hollywood’s go-to person for an on-screen engineer?
Actor Jeff Goldblum recently appeared as a guest host for the Jimmy Kimmel Live! TV show. Kimmel was on vacation. As part of his first-night …
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Videos
Featured Chalk Talk
Unlock the Productivity and Efficiency of a Connected Plant
In this episode of Chalk Talk, Amelia Dalton and Patrick Casey from Schneider Electric explore the multitude of benefits that mobility brings to industrial applications. They investigate how Schneider Electric’s Harmony Hub can simplify monitoring and testing, increase operational efficiency and connectivity openness in industrial plants, and how NFC technology can bring new innovation possibilities to IIoT applications.
Chalk Talk
Mobility in Manufacturing: Unlock the Productivity and Efficiency of a Connected Plant
Sponsored by Schneider Electric & Mouser
Featured Video
Next-Gen Power Management for Edge AI Applications
In this VideoBoost, we take a quick look at how advanced power management ICs are enabling the next generation of edge AI devices. Learn how these compact solutions deliver the efficiency and thermal performance that demanding AI workloads require in space-constrained designs.
VideoBoost
Next-Gen Power Management for Edge AI Applications
Sponsored by Example Corp
Featured Blogs
[featuredblogs]
Featured Paper
Sponsored by Siemens Digital Industries Software
A game-changer for IP designers: design-stage verification
In this new technical paper, you’ll gain valuable insights into how, by moving physical verification earlier in the IP design flow, you can locate and correct design errors sooner, reducing costs and getting complex designs to market faster. Dive into the challenges of hard, soft and custom IP creation, and learn how to run targeted, real-time or on-demand physical verification with precision, earlier in the layout process.
From the Archives
Timeless technical content worth another look, brought to you by our sponsors.
EdBoost
Understanding Power Integrity in High-Speed PCB Design
A deep dive into power delivery network design, decoupling strategies, and how to avoid the pitfalls that plague high-speed digital designs …
EdBoost
RISC-V Verification: From Simulation to Silicon
How automated verification tools are changing the game for RISC-V IP designers, and what it means for the broader semiconductor ecosystem …
EdBoost
The State of Chiplet Interconnect Standards
UCIe, BoW, and the emerging standards landscape — what engineers need to know about multi-die integration and heterogeneous packaging …
No Slacking! Put Your Semicolons to Work
Hi Karl — I’m not sure what point you are trying to make — you say that there’s no way to increase performance meaningfully using edge-triggered …
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