A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Click here for more information about Vishay Semiconductors Signal DFN Package
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