With smaller electronics, more options can be fit into the package, allowing for features such as RF transceivers for wireless communication, advanced sensors to optimally time pacing and defibrillation shocks and backup systems in case the main system fails. While integrated circuits (ICs) have taken advantage of advances in dense packaging, such as die stacking, in most cases the discrete components remain unchanged. Market pressures are now forcing improvements in the current discrete packaging.
More Articles
-
Sticking With their Story: Zeno Demonstrates 1T SRAM at Leading Nodes
Let’s face it: We’re addicted to SRAM. It’s big, it’s power-hungry, but it’s fast. And no matter how much we…
-
Bill Godbout Perishes in Northern California’s Camp Fire
People of a certain age, who mindfully lived through the early microcomputer revolution during the first half of the…
-
Costs for Sub-20nm Wafers put Another Nail in Moore’s Law’s Coffin
IC Insights has just published the September Update to The 2018 McClean Report, and one figure (reproduced below) puts…
Leave a Reply
You must be logged in to post a comment.