ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges

ANSYS (NASDAQ: ANSS) subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics at the Design Automation Conference (DAC).

Where: Design Automation Conference, Moscone Convention Center, San Francisco, CA, Booth #1813

When: Monday, June 3 through Wednesday, June 6, from 9:00 a.m. to 6:00 p.m.

What: Meet with Apache, its customers, and partners at DAC to hear leading companies share their expert perspectives and best practices. Live presentations will feature low-power design methodologies with LSI and Renesas; power delivery integrity with Aptina, Ciena, NXP Semiconductor, Samsung-DT and Samsung-SSI; advanced reliability simulation with AMD andnVidia; chip-package-system analysis with Samsung-DRAM and ST-Ericsson; and 3D-IC / stacked-die design challenges with UCSD. Click here to register for a session.

Apache’s Power Team Experts will be on hand to discuss and demonstrate the latest advanced methodologies and design techniques for ultra-low-power, reliability, chip-package-system, and 3D-IC solutions, including the recently announced RedHawk-3DX fourth-generation power sign-off solution. Click here to register now.

Working with Apache’s eco-system partners is key to advancing low-power innovation in today’s fast-paced industry environment. Apache will be participating and speaking in several partner booths at DAC including:

ARM Connected Community Pavilion – Booth #802
Tuesday, June 5 at 11:00 a.m.

GlobalFoundries Partner Pavilion – Booth #303
Wednesday, June 6 at 1:00pm

TSMC OIP Theater – Booth #2430
Monday, June 4 at 10:00 a.m.
Tuesday, June 5 at 3:30 p.m.
Wednesday, June 6 at 1:45 p.m.

Apache technology experts will also be participating in several DAC panel sessions discussing a variety of industry topics including:

DAC Panel Pavilion – Booth #310
Monday, June 4 at 10:30 a.m.

Si2 Round-Up: Standards in Action – Room #301
Monday, June 4 at 3:15 p.m.

Click here for a complete schedule.

Details of Apache’s DAC activities, along with advanced registration for customer and product presentations can be found at http://www.apache-da.com/company/events/DAC2012. Register and attend three or more Apache customer presentations and enter a drawing to win an Apple® MacBook Air.