Designing cloud-connected applications with FPGAs can be a daunting engineering challenge. But, new platforms promise to simplify the process and make cloud-connected IoT design easier than ever. In this episode of Chalk Talk, Amelia Dalton chats with Tak Ikushima of Intel about how a collaboration between Microsoft and Intel is pushing innovation forward with a new FPGA Cloud Connectivity Kit.Â
Click here for more information about Terasic Technologies FPGA Cloud Connectivity Kit
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