Archives: Articles
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Interop Technologies to Provide Hosted Multimedia Messaging And Device Management Solutions to Innovative Wireles
FORT MYERS, FL—June 29, 2010—Interop Technologies, a provider of core solutions for messaging, device management, and connectivity gateways, today announced that it has signed a contract with Vitelcom Cellular Inc., doing…
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Conexant and Nu Horizons Electronics Announce Design-Wins for Audio-Enabled Products
NEWPORT BEACH, Calif.– Conexant Systems, Inc. (NASDAQ: CNXT), a leading supplier of innovative semiconductor solutions for imaging, audio, embedded modem, and video surveillance applications, and…
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“Lattice Diamond” FPGA Design Software Heralds New Era For Low Power, Cost Sensitive FPGA Applications
HILLSBORO, OR — JUNE 28, 2010 — Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced Version 1.0 of its Lattice Diamond™ FPGA design software, the new flagship…
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Ultralow VIN DC/DC µModule Regulator with Onboard 5V MOSFET Gate Drive Delivers 15A from Inputs Down to 1.5VIN
MILPITAS, CA – June 28, 2010 – Linear Technology Corporation introduces the LTM4611, a complete switch mode DC/DC µModule® point-of-load regulator capable of generating its…
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Ultralow VIN DC/DC µModule Regulator with Onboard 5V MOSFET Gate Drive Delivers 15A from Inputs Down to 1.5VIN
MILPITAS, CA – June 28, 2010 – Linear Technology Corporation introduces the LTM4611, a complete switch mode DC/DC µModule® point-of-load regulator capable of generating its…
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Zen and the Art of Modelling FPGAs
What is the sound of one hand clapping? If a tree falls in the forest and no one is there, does it make a sound?…
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Rugged PC/104 CPU Board with Ultra Low Power, Cost-effective SoC from Advantech
Irvine, CA, June 22, 2010 –Advantech, a leading embedded platform and integration services provider has just released a cost-effective System On Chip (SoC) PC/104 CPU module driven…
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Bluespec High-Level Synthesis Toolset is Selected by Fujitsu
Waltham, Mass. – June 10, 2010 – Bluespec Inc. announced today that the Bluespec high-level synthesis toolset for development of system-on-a-chip (SoC) designs has been…
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CMP/CMC/MOSIS partner to introduce a 3D-IC process
Grenoble, France, 22 June 2010, CMP/CMC/MOSIS are partnering to offer a 3D-IC MPW service based on Tezzaron’s SuperContact technology and GLOBALFOUNDRIES 130nm CMOS. The first MPW run…
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LPI Certification Exams Exceed 250,000 Worldwide
(Sacramento, CA, USA: June 24, 2010) The Linux Professional Institute (LPI), the world’s premier Linux certification organization (http://www.lpi.org), announced that they delivered over 258,000 exams and 85,000 certifications…
