Archives: Articles
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Chips&Media to Present Latest Video Solutions at SoCIP 2010 Symposium in Shanghai, Beijing China
Chips&Media, Inc., the leading provider of Video Intellectual property (IP) cores will participate in SoCIP Symposium under the theme “The Era of Designing with System-prototyping…
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Ember demos IP-based Stack at ConnectivityWeek 2010
Ember today announced it will give attendees of ConnectivityWeek 2010 a preview of the new Internet Protocol (IP)-based low-power, wireless networking product it is currently…
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Acrosser announces the latest embedded solutions at Computex 2010,from 1st-5th June in Taipei
Acrosser will announce a line of new products focus on ARES series, network security, In-Vehicle PC and ACE series. In addition, Acrosser will present the…
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SIE Computing Solutions Offers Enhanced Complete System Maintenance Services
Brockton, MA, May 24, 2010 – SIE Computing Solutions Inc., a provider of rugged electronic systems for mission-critical embedded computing platforms deployed in harsh environments, today announced that it will…
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High Power Multiphase Step-Down DC/DC Controller Features Differential Remote Sensing, Active Voltage Positioning & Stage Shedding Technology
MILPITAS, CA – May 24, 2010 – Linear Technology Corporation introduces the LTC3856, a two-phase single output high efficiency (up to 95%) synchronous step-down DC/DC…
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High Power Multiphase Step-Down DC/DC Controller Features Differential Remote Sensing, Active Voltage Positioning & Stage Shedding Technology
MILPITAS, CA – May 24, 2010 – Linear Technology Corporation introduces the LTC3856, a two-phase single output high efficiency (up to 95%) synchronous step-down DC/DC…
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Most adavanced ADC module with built-in processig resource is launched
RENO, NEVADA – 18th May 2010 – Sundance Digital Signal Processing Inc., a leading provider of high performance signal processing and reconfigurable multiprocessor systems today…
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Tanner EDA Expands Presence in Southeast Asia
MONROVIA, California – May 19, 2010 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs)…
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Agilent Technologies’ Latest 3D EM Simulation Software Accelerates High-Frequency, High-Speed Design
SANTA CLARA, Calif., May 20, 2010 — Agilent Technologies Inc. (NYSE: A) today announced Electromagnetic Professional (EMPro) 2010, a new release of its 3D electromagnetic (EM) modeling and…
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Access to TSMC technologies through leading European partners: imec and DELTA partner to provide comprehensive ASIC solutions
Leuven, Belgium and Copenhagen, Denmark – 18 May, 2010 – Imec, certified TSMC Value Chain Aggregator (VCA), and DELTA Microelectronics, a leading provider of ASIC…