News – Page 1023 – EEJournal

Embedded Studio: New beta reduces program size by up to 12%!

Monheim, Germany – October 15th, 2018 – SEGGER just released a new beta version of its powerful cross-platform development software “Embedded Studio”. The new version…

October 18, 2018

TI’s TPS650861 Multi-Rail PMICs, Now Shipping at Mouser, Offer Scalable Solutions for Both Small and High-Power Designs

October 15, 2018 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the TPS650861 multi-rail…

October 17, 2018

C&K Launches New Fully Sealed Construction DIP Switch

NEWTON, Mass., 15 October, 2018 – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announced the launch of its new…

October 17, 2018

Comau presents MATE, its new wearable exoskeleton, for the first time in Brazil at EXPOMAN 2018

Belo Horizonte, October 15, 2018 – Comau, worldwide leader in industrial automation, is officially presenting its latest innovations to the Brazilian market during the annual…

October 17, 2018

Express Logic Achieves EAL4+ Common Criteria Security Certification for X-Ware IoT Platform® Secure Connectivity (SC)

San Diego, CA, October 16, 2018 — Express Logic today announced that thanks to its collaboration with the world’s leading security evaluation labBrightsight, its X-Ware IoT Platform® Secure Connectivity…

October 17, 2018

Faster, More Flexible Probe from STMicroelectronics Eases STM8 and STM32 Programming on the Bench or in the Field

STMicroelectronics has introduced the next-generation STLINK-V3 probe for programming and debugging STM8 and STM32 microcontrollers , adding enhancements to further increase flexibility and efficiency. Now featuring mass-storage support, a virtual COM…

October 17, 2018

Archives: News

Embedded Studio: New beta reduces program size by up to 12%!

TI’s TPS650861 Multi-Rail PMICs, Now Shipping at Mouser, Offer Scalable Solutions for Both Small and High-Power Designs

C&K Launches New Fully Sealed Construction DIP Switch

Comau presents MATE, its new wearable exoskeleton, for the first time in Brazil at EXPOMAN 2018

Express Logic Achieves EAL4+ Common Criteria Security Certification for X-Ware IoT Platform® Secure Connectivity (SC)

Faster, More Flexible Probe from STMicroelectronics Eases STM8 and STM32 Programming on the Bench or in the Field

Flex Logix to Demonstrate Modular eFPGA AT Arm TechCon

Synopsys Delivers Platform Architect Ultra to Enable the Next Wave of AI SoCs

Ford Selects Wind River Over-the-Air Update Technology

Monitor Temperature at Multiple Locations with Low-power 1.8V Temperature Sensor Family