Archives: News
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Synopsys Announces Availability of TSMC-certified IC Design Environment in the Cloud
MOUNTAIN VIEW, Calif., Oct. 3, 2018 /PRNewswire/ — Highlights: Synopsys Cloud Solution available to host customers designing in the cloud with TSMC process technology, accelerating IC design…
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Optimized troubleshooting in multi-chip systems: PLS’s UDE enables synchronous debugging of AURIX multi-chip systems for the first time
auta (Germany), Sunnyvale (CA), October 4, 2018 – With the new Multi-Target Debug Adapter suitable for the Universal Access Device 3+ (UAD3+) of the Universal…
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TSMC Recognizes Synopsys with Four Partner Awards at the Open Innovation Platform Forum Event
MOUNTAIN VIEW, Calif., Oct 3, 2018 /PRNewswire/ — Highlights: TSMC selects Synopsys as its “Partner of the Year” for interface IP and tool enablement for 8th consecutive…
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Molex Announces Industry-First Spot-On Connector System
LISLE, IL – October 3, 2018 – Molex introduces the first-of-its-kind SMT potting wire-to-board connector system with the Spot-On 1.5 and 2.0. This system not only improves process…
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Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
SAN JOSE, Calif., 02 Oct 2018 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital tools and advanced IC packaging solutions support the…