News – Page 1058 – EEJournal

SEGGER supports new Microchip SAML11 with embOS RTOS and advanced development tools

Hilden, Germany – July 9th, 2018 – SEGGER announces full support for Microchip’s new SAML11 devices within their complete lineup of embedded development solutions. Start developing with…

July 9, 2018

Imec and Soitec Demonstrate Sequential 3D Planar Device Achieving High-Reliability at Low Temperature

LEUVEN (Belgium), JULY 9, 2018 — Today at its annual Imec Technology Forum USA in San Francisco, imec, the world-leading research and innovation hub in nanoelectronics and…

July 9, 2018

ams laser arrays bring face recognition to Android-based smartphones

Premstaetten, Austria (9 July, 2018) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced that its low-power IR VCSEL laser…

July 9, 2018

Molex Announces Next-Generation Data Center Solutions to Address Expanding Bandwidth and Data Rate Needs

LISLE, IL – July 2, 2018 – Molex, a global provider of electronic solutions, today announced its full line of next-generation data center infrastructure solutions to address expanding hyperscale requirements,…

July 6, 2018

Pickering Interfaces to demonstrate PXI and LXI Switching Solutions and Signal Routing Software at SEMICON West

July 4th, 2018 – Chelmsford, MA, USA – Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification,…

July 6, 2018

Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0

SAN FRANCISCODESIGN AUTOMATION CONFERENCE, June 26, 2018 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® Perspec System Verifier supports the new Accellera…

July 6, 2018

Bosch launches new generation of smart sensor hubs BHI260 and BHA260 for wearables, hearables, AR/VR and other mobile devices

Enables sophisticated always-on sensor applications, while significantly reducing the system power consumption in mobile, battery-operated devices Updated MEMS sensors and a new, powerful MCU integrated…

July 6, 2018

Archives: News

SEGGER supports new Microchip SAML11 with embOS RTOS and advanced development tools

Imec and Soitec Demonstrate Sequential 3D Planar Device Achieving High-Reliability at Low Temperature

ams laser arrays bring face recognition to Android-based smartphones

Molex Announces Next-Generation Data Center Solutions to Address Expanding Bandwidth and Data Rate Needs

Pickering Interfaces to demonstrate PXI and LXI Switching Solutions and Signal Routing Software at SEMICON West

Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0

Bosch launches new generation of smart sensor hubs BHI260 and BHA260 for wearables, hearables, AR/VR and other mobile devices

Texas Instruments’ 16-Bit ADS112C04 ADC, Now at Mouser, Offers Low-Power Conversion for Small Sensor Signals

Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration

Qorvo® Powers New Commercial 802.11ax Carrier Gateway