News – Page 1071 – EEJournal

Marvell Launches New Client NVMe SSD Controller Family for Emerging 96-Layer NAND-Based SSDs

SANTA CLARA, Calif. (June 5, 2018) – Marvell (NASDAQ:MRVL), a leader in storage, networking and connectivity semiconductor solutions, today announced its latest NVM Express® (NVMe™) solid-state drive (SSD)…

June 5, 2018

Sensera’s MEMS Mimic Human Organs Through Bioengineering

Woburn, MA, June 4, 2018 – Sensera Inc., a leading provider of MEMS devices, isadapting its technology for new applications in bioengineering. The company’s MEMS, or MicroElectroMechanical Systems, technology is now…

June 5, 2018

Automotive CoolSiC™ Schottky diodes: combining performance and robustness

Jun 4, 2018 | Market News Munich, Germany – 4 June 2018 – At this year’s PCIM Europe trade fair in Nuremberg (June 5 to June 7)…

June 4, 2018

Three new Class-D amplifiers solve smart-home audio design challenges

DALLAS (June 4, 2018) – Texas Instruments (TI) (NASDAQ:TXN) today introduced three new digital-input Class-D audio amplifiers that enable engineers to deliver high-resolution audio in…

June 4, 2018

Vishay’s New High Current Planar Choke Inductor Delivers Same Performance as Wirewounds in Fraction of Space

MALVERN, Pa. — June 4, 2018 — A new high current planar choke inductor that offers the same performance as wirewound devices in a fraction of the space…

June 4, 2018

STMicroelectronics’ NFC Technology Chosen to Distinguish TCL Communication’s Alcatel 3V Smartphone through Outstanding Contactless User Experience

ST’s integrated NFC controller certified to GSMA, EMVCo and NFC Forum standards minimizes time to market v ST and TCL Communication intend to cooperate on digital…

June 4, 2018

Archives: News

Marvell Launches New Client NVMe SSD Controller Family for Emerging 96-Layer NAND-Based SSDs

Sensera’s MEMS Mimic Human Organs Through Bioengineering

Automotive CoolSiC™ Schottky diodes: combining performance and robustness

Three new Class-D amplifiers solve smart-home audio design challenges

Vishay’s New High Current Planar Choke Inductor Delivers Same Performance as Wirewounds in Fraction of Space

STMicroelectronics’ NFC Technology Chosen to Distinguish TCL Communication’s Alcatel 3V Smartphone through Outstanding Contactless User Experience

Si2 Launches Effort to Standardize New IC Design Language

Increase System Performance in Closed-loop Control Applications with New PIC® and AVR® MCUs

IAR Systems simplifies development of event-driven embedded systems with updated design and code generation tool

Arm announces new suite of IP for premium mobile experiences