Archives: News
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UnitedSiC’s 1200 V Silicon Carbide FETs deliver industry’s highest-performance upgrade path for IGBT, Si and SiC-MOSFET users
May 24, 2018, Princeton, New Jersey: Designers of Power Factor Correction stages (PFCs), Active Frontend Rectifiers, LLC converters and Phase Shift Full Bridge converters can…
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Rugged Modular Power Supplies Support 30 W to 120 W Range for PCI-104 and COM Express-based Platforms
Technical Highlights: Ranges between 30 W and 120 W outputs and 11.4 VDC to 50 VDC inputs Can be used in a PC/104 stack; as…
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Silex Inside HDMI over IP OEM solution is interoperable with AES67 and SMPTE 2110 standards
Louvain-la-Neuve, Belgium – May 24th 2018 – Silex Inside, leading provider of video compression technology and OEM solutions in the pro A/V market, is announcing the support…
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Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
BMR466 and BMR461 DC/DC converters now offer power system architects more design options with choice of BGA or LGA packages •    Targeting distributed…
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Saelig Introduces UHF Narrow Band Multi-channel Transceiver
Fairport, NY, USA: Saelig Company, Inc. (www.saelig.com) has introduced the STD-302Z 434MHz Narrow Band Multi-Channel Transceiver – a half-duplex UHF radio module that is suitable for industrial remote…
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Annapolis Micro Systems Introduces Industry’s First COTS Mezzanine with New Xilinx® RF System-on-Chip
Annapolis Micro Systems, a leading FPGA board and systems supplier, announced today the availability of the industry’s first COTS FMC+ Mezzanine to feature the new…
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Vishay Intertechnology High Speed PIN Photodiode Offers Enhanced Sensitivity for Visible Light, Enables Slim Sensor Designs for Wearables
MALVERN, Pa. — May 21, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today broadens its optoelectronics portfolio with the introduction of a new high speed silicon…
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Kudelski Group and u-blox to collaborate on secure connectivity 
for consumer, automotive and industrial IoT
CHESEAUX-SUR-LAUSANNE, Switzerland and THALWIL, Switzerland, May 22, 2018 – The Kudelski Group (SIX:KUD.S), the world leader in digital security, and u‑blox (SIX:UBXN), a global leader in positioning…
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Cadence Design Systems and NI Announce Collaboration to Simplify Next-Generation Semiconductor and RF Development
Highlights: •    Cadence and NI collaborate to improve the overall semiconductor development and test process, reducing design cycle time and improving quality of…
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University of Colorado’s Laboratory for Atmospheric and Space Physics adopts Ada and GNAT Pro for NASA project
PARIS & NEW YORK, May 22, 2018 – AdaCore today announced that the University of Colorado’s Laboratory for Atmospheric and Space Physics (LASP) has selected the Ada language and the…