News – Page 1131 – EEJournal

Rohde & Schwarz demonstrates innovative T&M equipment for next generation designs at embedded world 2018

Rohde & Schwarz will be presenting its T&M instruments with the tagline “Oscilloscope innovation. Measurement confidence”. Tests on electronic circuits have shown that these instruments…

January 22, 2018

Thalia expands with new analog design engineering facility

CWMBRAN, UK and Hyderabad, India, 22 January 2018 – Thalia Design Automation today announced a significant expansion of its analog design engineering capabilities, with the opening of a new…

January 22, 2018

Pentek Announces Kintex UltraScale FMC Carrier for 3U VPX

3U VPX Carrier for Pentek Flexor FMC and FMC+ Modules JadeFX Architecture with Xilinx Kintex UltraScale FPGA FlexorSet Integrated Sub-systems Navigator Design Suite for Streamlined…

January 22, 2018

New Vishay Intertechnology AEC-Q200 Qualified, Medium Voltage Thick Film Chip Resistors Save Space and Reduce Component Counts

MALVERN, Pa. — Jan. 17, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of AEC-Q200 qualified, medium voltage thick film chip resistors.…

January 22, 2018

100G Lambda MSA Releases Preliminary Specifications for Next Generation Optical Interconnects

San Jose, California – January 17, 2018 – The 100G Lambda Multi-Source Agreement (MSA) Group has announced the release of preliminary specifications based on 100 Gbps per…

January 22, 2018

Alliance Memory Launches New 256Mb High-Speed CMOS SDRAMs in the 54-Pin TSOP II Package

SAN CARLOS, Calif. — Jan. 17, 2018 — Alliance Memory today extended its offering of 256Mb high-speed CMOS SDRAMs with new x8 and x4 devices…

January 22, 2018

Plessey demonstrates microLED-based AR and VR HUD Concept to industry leaders during CES 2018

Plymouth, ENGLAND – 18 January 2018: Plessey Semiconductors, a leading developer of award-winning optoelectronic technology solutions, has successfully demonstrated how its monolithic microLED technology can…

January 22, 2018

RS Components launches DesignSpark Pmod adapter for the Raspberry Pi

LONDON, UK, 18 January, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, today announced the launch…

January 19, 2018

AVX to Present Paper on Advances in High-Reliability Conductive Polymer Capacitors at MRQW 2018

FOUNTAIN INN, S.C. (January 18, 2018) – AVX Corporation, a leading manufacturer and supplier of passive components, interconnects, sensors, and control solutions, will present a technical…

January 19, 2018

Discover Silicon Labs’ One-Stop-Shop IoT Connectivity Solutions at Embedded World

AUSTIN, Texas – Jan. 18, 2018 – Silicon Labs (NASDAQ: SLAB) Silicon Labs will showcase a variety of low-power wireless connectivity solutions for smart homes, building automation,…

January 18, 2018

Archives: News