News – Page 1135 – EEJournal

4D Systems challenges visitors at Embedded World 2018 to “Display it!” with embedded display design challenge

Sydney, Australia: 4D Systems today announced it will demonstrate its leading gen4 HMI display modules and Workshop4 IDE software at Embedded World 2018 Nuremberg. Visitors…

January 12, 2018

RS Components makes USB simpler, safer, more secure with Rosenberger magnetic connectors

LONDON, UK, 11 January, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has the solution for easier and…

January 12, 2018

Protecting Security-Sensitive Software From Spectre

Ithaca, NY (USA) — January 11, 2018 – GrammaTech, Inc., a leading developer of commercial embedded software assurance tools and advanced cybersecurity solutions, today announced that mitigation…

January 11, 2018

Bosch launches high-performance IMU for drone and robotics applications at CES 2018

Excellent vibration robustness and suppression Stable to large temperature changes Automotive-proven low drift gyroscope and superior accelerometer performance Bosch booth at CES: Las Vegas Convention…

January 10, 2018

New era in high field superconducting magnets – opening new frontiers in science, nanotechnology and materials discovery

Oxford Instruments is delighted to congratulate our partners at the National High Magnetic Field Laboratory (NHMFL) on the successful demonstration of a 32 Tesla all-superconducting…

January 10, 2018

Imec’s SWEET study Collects World’s Largest Dataset on Stress Detection

LEUVEN, Belgium—Jan. 9, 2018 – Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, announced today that it has collected the largest multisensor…

January 10, 2018

Milwaukee School of Engineering (MSOE) Fluid Power Industrial Consortium (FPIC) Announces its First 2018 Quarterly Half-Day Seminar on “Smart Sensors for Fluid Power Components and Systems”

Milwaukee, WI …January 9, 2018 … The Milwaukee School of Engineering (MSOE) Fluid Power Industrial Consortium (FPIC) has announced the next in its series of…

January 10, 2018

Archives: News

4D Systems challenges visitors at Embedded World 2018 to “Display it!” with embedded display design challenge

RS Components makes USB simpler, safer, more secure with Rosenberger magnetic connectors

Protecting Security-Sensitive Software From Spectre

Bosch launches high-performance IMU for drone and robotics applications at CES 2018

New era in high field superconducting magnets – opening new frontiers in science, nanotechnology and materials discovery

Imec’s SWEET study Collects World’s Largest Dataset on Stress Detection

Milwaukee School of Engineering (MSOE) Fluid Power Industrial Consortium (FPIC) Announces its First 2018 Quarterly Half-Day Seminar on “Smart Sensors for Fluid Power Components and Systems”

Antenova’s latest compact antenna boosts GNSS signals from difficult locations and will be on show at CES

Artila launches the Mobile Fanless & Wide-Temperature IoT Gateway Matrix-713

TANAKA Begins Shipments of SJeva, a Newly-developed, High-Quality Au Deposition Material