News – Page 1176 – EEJournal

Pixus Announces New Sizes for Its RiCase Line of Instrumentation Cases

Waterloo, Ontario — Sept 25, 2017 – Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers the RiCase Premier line of modular electronics enclosures in…

September 25, 2017

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications

Santa Clara, Calif., September 20, 2017 — GLOBALFOUNDRIES today announced its vision and roadmap for a sweeping range of technology platforms designed to help customers transition…

September 25, 2017

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform

Santa Clara, Calif., September 20, 2017 — GLOBALFOUNDRIES today announced the availability of its radio frequency/analog PDK (22FDX®-rfa) solution for next-generation wireless and IoT chipsets and…

September 25, 2017

GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications

Santa Clara, Calif., Sept. 20, 2017 — GLOBALFOUNDRIES today announced the availability of the industry’s first RF SOI foundry solution manufactured on 300mm wafers. The company’s…

September 22, 2017

Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor

First dedicated hardware solution with flexible bit depth support from 16-bit down to 4-bit Lowest bandwidth Neural Network (NN) solution Architected to support multiple operating…

September 22, 2017

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

Sep 20, 2017 Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI Santa Clara, Calif., Sept. 20, 2017 – GLOBALFOUNDRIES is…

September 22, 2017

Imagination’s new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices

LONDON, UK – 21st September, 2017 – Imagination Technologies (IMG.L) announces a new generation of PowerVR GPUs that raises the bar on graphics and compute…

September 22, 2017

Archives: News

Pixus Announces New Sizes for Its RiCase Line of Instrumentation Cases

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform

GLOBALFOUNDRIES Delivers 8SW RF SOI Technology for Next-Generation Mobile and 5G Applications

Imagination reveals PowerVR Neural Network Accelerator (NNA) with 2x the performance and half the bandwidth of nearest competitor

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems

Imagination’s new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices

Synopsys Design Platform Certified by GLOBALFOUNDRIES for 22nm FD-SOI Process Technology

TEWS TECHNOLOGIES Launches PMC with 16 or 8 Channel ADC, 8 or 4 Channel DAC and 14 Channel Digital I/O

Acromag’s New Ethernet Communication Modules Offer Optional Power Over Ethernet