Archives: News
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ICE-P3 EPU Integrates Temperature-Compensated Voltage and Frequency Control for Maximum Energy Savings
San Jose, Calif. – June 26, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today…
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Mentor launches unique, end-to-end Xpedition High- Density Advanced Packaging flow
The Mentor® Xpedition® High-Density Advanced Packaging (HDAP) flow is the industry’s first comprehensive solution for the design and verification of today’s leading-edge IC package designs.…
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Mentor OSAT Alliance Program Streamlines IC High- Density Advanced Packaging Design and Manufacturing
Proven low-cost, low-risk path to designing HDAP technologies Trusted verification and signoff process for OSAT customers Increased OSAT business efficiency though proven Mentor flow Launches…
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Arastu Systems announces LPDDR3/4 Single Controller for optimal performance
June 21st, 2017, San Jose, CA – High-end computing applications requires Higher Performance keeping the Power and Latency intact. Arastu Systems, a product engineering services…
