News – Page 1267 – EEJournal

New STM32 Boards from STMicroelectronics Support Cost-Effective and Ultra-Low-Power LPWAN Evaluation for Long-Range IoT Connectivity

Geneva, February 17, 2017 – Two new ready-to-use prototype boards available from STMicroelectronics slash the cost for developers to start evaluating LoRaWAN™ and other Low-Power Wide Area Network (LPWAN) technologies…

February 17, 2017

Microsemi Collaborates with Silicon Creations to Enable Industry’s Lowest Power FPGA 12.7G Transceivers With PHYs for Microsemi’s PolarFire FPGAs

ALISO VIEJO, Calif. and SUWANEE, Ga., Feb. 16, 2017 /PRNewswire/ — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Silicon Creations, a…

February 16, 2017

Anritsu Redefines Microwave and mmWave Measurements with Introduction of the Ultraportable Spectrum MasterTM Family

Morgan Hill, CA – February 14, 2017 – Anritsu Company revolutionizes the test market with the introduction of the Spectrum MasterTM MS2760A family, the world’s first ultraportable,…

February 16, 2017

Mentor Graphics Announces Veloce Strato Platform Scales Up to 15BG

WILSONVILLE, Ore., February 16, 2017 – Mentor Graphics® Corporation(NASDAQ: MENT) today announced the Veloce® Strato™ emulation platform. The Veloce Strato platform is Mentor’s third generation data-center friendly emulation platform,…

February 16, 2017

Renesas Electronics Becomes First Semiconductor Supplier to Join Civil Infrastructure Platform Project to Accelerate Smart Industrial Devices

Düsseldorf, February 16, 2017 – Renesas Electronics, a premier supplier of advanced semiconductor solutions, a premier supplier of advanced semiconductor solutions, today announced that it has joined the…

February 16, 2017

Diodes Incorporated to Unveil Packet Switches, Dual MOSFETs and Transient Voltage Suppressors at Embedded World 2017

See Diodes in Hall 3A, Booth 431 Nuremberg, Germany – February 16th, 2017 – Diodes Incorporated will be introducing a number of notable new products at Embedded…

February 16, 2017

Aricent and Rohde & Schwarz Cybersecurity unveil a unique bandwidth control solution to enhance customer experience for mobile operators and network equipment providers

REDWOOD CITY, California/ Leipzig, Germany — February 14, 2017 — Aricent, a global design and engineering company, and Rohde & Schwarz Cybersecurity, leading vendor of…

February 15, 2017

Phoenix Contact Achieves Traceability Success with Mentor Graphics Valor IoT Manufacturing Solution

WILSONVILLE, Ore., February 14, 2017 — Mentor Graphics Corporation (NASDAQ: MENT) today announced that Phoenix Contact, the German-based market leader of device connectors, electronic components and…

February 15, 2017

Intepro’s Procyon Test Systems Combine Open-Source Integration with High-Efficiency Sources and Regenerative Loads

February 15, 2017—Intepro Systems, a market leader in power component and power system automated test equipment (ATE), announces its Procyon line of integrated production test…

February 15, 2017

Ametherm Glass-Encapsulated Thermistors Deliver Long-Term Stability and Reliability for Automotive and Industrial Applications

CARSON CITY, Nev. — Feb. 15, 2017— Ametherm today introduced a new series of glass-encapsulated thermistors that provide long-term stability and reliability for high-accuracy temperature…

February 15, 2017

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