Archives: News
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DenciTec® – PCB technology that takes miniaturization to the next level
Zurich, September 14, 2016 – Cicor (SIX Swiss Exchange: CICN), a leading international high-tech industrial group based in Boudry (Switzerland) specializing in printed circuit boards, microelectronics and…
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TEWS TECHNOLOGIES Introduces PCI Express x4, Gen3 XMC Carrier for Embedded I/O Applications
Halstenbek, Germany – 14th September 2016. TEWS TECHNOLOGIES increases its product portfolio of PCI Express carriers. The TPCE278 is a standard height PCI Express Revision…
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50Msps, 16-Bit DAC Demonstration Board Has Mojo
MILPITAS, CA – September 14, 2016 – Linear Technology Corporation introduces demonstration circuit 2459A, featuring the LTC1668, 50Msps, 16-bit digital-to-analog converter (DAC). This high performance…
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MIPI Alliance Developing MIPI Touch for Mobile Devices, Tablets and Automotive Applications
PISCATAWAY, N.J. and Mountain View, Calif., Sept. 14, 2016 – The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today introduced MIPI TouchSM, a…
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Leti and Oberthur Technologies Partner to Explore New Solutions in Fast-growing Digital Era
GRENOBLE and PARIS, France – Sept. 12, 2016 – Leti, an institute of CEA Tech, and OT (Oberthur Technologies), a leading global provider of embedded…
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ZigBee Alliance Adds 5th Authorized Test Lab to Accommodate Growth of IoT Product Certifications
Davis, Calif. – September 12, 2016 – The ZigBee Alliance, a non-profit association of companies creating, maintaining and delivering open, global standards for the low-power wireless…
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Robust 4Mbps CAN FD µModule Isolator with Power Improves System Reliability
MILPITAS, CA – September 13, 2016 – Linear Technology Corporation introduces the LTM2889, a fully ISO 11898-2 compliant CAN (controller area network) µModule® (micromodule) transceiver…
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Frontier Silicon and Marvell showcase new Wi-Fi network optimization technology
Dallas, 13th September 2016 — Frontier Silicon, a leading software provider for consumer audio devices, and Marvell, a global leader in providing complete silicon solutions, are extending…
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ANSYS AIM 17.2: Expanding Upfront Simulation for the Design Engineer
PITTSBURGH, September, 12, 2016 – With today’s latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the…
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GLOBALFOUNDRIES Extends FDX™ Roadmap with 12nm FD-SOI Technology
Santa Clara, Calif., September 8, 2016 — GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry’s first multi-node…