Archives: News
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TI’s new USB Type-C™ docking system design can cut solution size in half
DALLAS (August 11, 2016) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a multiport USB Type-C and Power Delivery (PD) minidock reference design that provides…
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u-blox miniature GNSS receiver optimized for covert asset tracking
Thalwil, Switzerland – August 11, 2016 – u-blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, today announced the EVA-M8Q GNSS receiver, completing its…
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High Voltage Dual Output Step-Down Charge Pump Offers Lower Power Dissipation with No Inductors
MILPITAS, CA – August 11, 2016 – Linear Technology Corporation announces the LTC3256, a highly integrated, high voltage low noise dual output power supply, which takes a single…
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Micron Introduces Mobile 3D NAND Solution for Next-Generation Smartphones
SANTA CLARA, Calif., Aug. 09, 2016 (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) today introduced the company’s first 3D NAND memory technology optimized for mobile…
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Eight-Channel Configurable 1A Buck DC/DCs Offer Flexibility, Up to 94% Efficiency & ±1% Accuracy for Multi-Rail Systems
MILPITAS, CA – August 10, 2016 – Linear Technology Corporation announces the LTC3374A, a highly integrated general-purpose power management solution for systems requiring multiple low…
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Kaynes Technology Implements Lean NPI Flow using Mentor Graphics Software
Wilsonville, Ore., August 10, 2016 — Mentor Graphics Corporation (NASDAQ: MENT) today announced that Kaynes Technology, a leading electronic manufacturing service (EMS) company based in Mysore, India, …
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Rockchip and CEVA Extend Partnership to Include CEVA-XM4 Intelligent Vision DSP
MOUNTAIN VIEW, Calif., – August 10, 2016 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced that Rockchip, China’s leading…
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ADLINK Technology Showcasing Predictive Maintenance and Network Functions Virtualization Solutions at Upcoming Intel Developer Forum (IDF16)
SAN JOSE, CA – August 9, 2016 – ADLINK Technology, Inc., a leading provider of embedded building blocks and Application-ready Intelligent Platforms (ARIPs) for the…
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GrammaTech’s Team TECHx Places Second in DARPA’s Cyber Grand Challenge
Las Vegas / Ithaca,  USA, August 9, 2016 — GrammaTech and its partner the University of Virginia took second place in DARPA’s Cyber Grand Challenge finale, showcasing…
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Orange Tree announces SuperSpeed USB 3.0 FPGA module
Oxford, UK – 9th August 2016 — Orange Tree Technologies today announced the ZestSC3, an easy to use FPGA module with a Xilinx Artix-7 user-programmable FPGA and a…