News – Page 1369 – EEJournal

Avnet Expands PicoZed Ecosystem with Updated FMC Carrier Card Kit

PHOENIX—May 17, 2016—Avnet, Inc. (NYSE: AVT), a leading global technology distributor, released the PicoZed™ FMC Carrier Card V2, a next-generation platform with improved FPGA Mezzanine Card (FMC)…

May 17, 2016

Toshiba Expands Synopsys IC Compiler II Usage Across Groups to Shorten Design Cycle

MOUNTAIN VIEW, Calif., May 17, 2016 /PRNewswire/ — Highlights: IC Compiler II has enabled Toshiba to achieve successful tapeout for over a dozen designs across established and…

May 17, 2016

Lattice Announces First Programmable ASSP (pASSP) Interface Bridge for Mobile Image Sensors and Displays

Industry’s first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors and displays. Defines a new class of programmable ASSPs combining…

May 16, 2016

Automotive industry qualified power inductors from TT Electronics are robust and efficient

Weybridge, UK, 16 May 2016 – TT Electronics, a global provider of engineered electronics for performance critical applications, today launched the HA78 series of power…

May 16, 2016

ProTek Devices Beefs Up Circuit Protection Offering Across Networking, Mobile and other Computing Applications

TEMPE, Ariz. – May. 16, 2016 – ProTek Devices™ has introduced two new circuit protection components that shield a variety of networking, mobile and other computing applications…

May 16, 2016

UltraSoC announces significant product update, improved support for analytics and ‘any CPU’ capability

CAMBRIDGE, United Kingdom, 16th May 2016 — UltraSoC today announced the latest version of its advanced semiconductor IP and software tools for SoC development, debug, optimization and…

May 16, 2016

STMicroelectronics Reveals Advanced Silicon-Carbide Power Devices to Accelerate Automotive Electrification

Complete set of devices allows full conversion of auto power modules to silicon carbide (SiC) for greater vehicle range, convenience, and reliability Advanced 6-inch wafer…

May 16, 2016

Micronas Deploys ClioSoft SOS Design Collaboration Platform

REMONT, Calif., May 17, 2016 – Micronas, a TDK group company and the most preferred partner for sensing and control, has deployed ClioSoft’s SOS7 Design…

May 16, 2016

Uurmi Fog Removal Software Now Available on Cadence Tensilica Vision DSPs

SAN JOSE, Calif., May 16, 2016–Cadence Design Systems, Inc. (NASDAQ: CDNS) and Uurmi Systems today announced that Uurmi’s fog removal software targeted for automotive and…

May 16, 2016

Encapsulated DC-DC converters offer chassisor DIN rail mounting

XP Power today announced the DTE series of fully encapsulated single output DC-DC converters. The series comprises three ultra-wide input voltage range models offering 20…

May 13, 2016

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