Archives: News
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New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies
MUNICH, Germany, 03 May 2016 — Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) unveiled the Allegro® 17.2-2016 portfolio, which enables a more predictable…
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Curtiss-Wright Expands Ultra Small Form Factor Rugged System Family with Quad-Core Intel® Atom™ Highly Modular Mission Computer
AUVSI XPONENTIAL 2016 (BOOTH #873), NEW ORLEANS, La. – May 3, 2016 – Curtiss-Wright’s Defense Solutions division today announced the newest member of its Parvus®…
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Imec Honors Dr. Gordon Moore with “Lifetime of Innovation Award”
Leuven (Belgium) – May 3, 2016 – World-leading nanoelectronics research center imec has announced that Dr. Gordon E. Moore, creator of the famous Moore’s law…
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TI’s 65-V micro-power buck converters feature industry’s lowest quiescent current
DALLAS (May 2, 2016) – Texas Instruments (TI) (NASDAQ: TXN) today introduced two 65-V, 150-mA synchronous DC/DC buck converters with the industry’s lowest 10.5-uA quiescent…
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Altium Releases New Documentation-Focused Update to Flagship PCB Design Platform
San Diego, Calif. – May 3, 2016 – Altium has announced the release of an update to their flagship PCB design platform, Altium Designer 16.1…
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STMicroelectronics Brings Superior Indoor and Undercover Navigation to Mobiles and Wearables
Geneva, May 4, 2016 – Smartphones, as well as smartwatches, fitness trackers and other wearables are about to get better at guiding users and mapping…
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Cadence Expands OrCAD Solution to Address Flex and Rigid-Flex Design Challenges for IoT, Wearables and Mobile Devices
Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) announced the OrCAD 17.2-2016 release with new capabilities for OrCAD® Capture, PSpice® Designer and PCB…
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Semtech Announces the Industry’s First Single Chip Hybrid PLC and LoRa® Wireless Platform for Smart Grid, Smart Metering and IoT Applications
CAMARILLO, Calif., May 3, 2016 – Semtech Corporation (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, announced today the availability of its new EV8600 dual modem (PLC+RF…
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Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
SAN JOSE, Calif., 02 May 2016 — Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Cadence® Tensilica® Vision P6 digital signal processor (DSP), Cadence’s…
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IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1™-2016
Elk Grove, Calif., May 3, 2016– Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation (EDA) and intellectual…