News – Page 1394 – EEJournal

Xilinx Debuts Multiple Industry-First Solutions for Ultra-High Bandwidth Optical Networks at OFC 2016

SAN JOSE, Calif., March 16, 2016 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will introduce multiple industry-first solutions for ultra-high bandwidth optical networks at OFC 2016. Targeting OTN and…

March 16, 2016

Microsemi Announces New Secured FPGA Production Programming Solution to Prevent Overbuilding, Cloning, Reverse Engineering, Malware Insertion and Other Security Threats

ALISO VIEJO, Calif., March 15, 2016 — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of…

March 16, 2016

Mentor Graphics Announces a Secure Plug-and-Play IoT Device and Data Acquisition Solution for Electronics Manufacturing

Wilsonville, OR, Mar. 16, 2016 — Mentor Graphics Corporation (NASDAQ: MENT) today announced the Valor® internet of things (IoT) Manufacturing solution, a robust hardware device with embedded…

March 16, 2016

Highly Integrated Multiprotocol Transceiver Reduces Component Count in RS485/RS232 Systems

MILPITAS, CA – March 16, 2016 – Linear Technology Corporation introduces the LTC2873, an RS485/RS232 multiprotocol transceiver in a small 20mm² package. The LTC2873 integrates all the functions…

March 16, 2016

New MEMS Design Contest Encourages Advances in MEMS Technology

Dresden, Germany – March 16, 2016 – Jointly sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, a new MEMS Design Contest is being…

March 16, 2016

Cadence Design Tools Certified for TSMC 7nm Design Starts and 10nm Production

SAN JOSE, Calif., , 15 Mar 2016 Highlights: Cadence tools and PDK enabled based on the latest 7nm DRM and SPICE for early customers Cadence…

March 15, 2016

Dialog Semiconductor Releases the Lowest Power 12 Degrees-of-Freedom Bluetooth® Smart Sensor Development Platform

London, United Kingdom – March 15, 2016 – Dialog Semiconductor plc (FWB:DLG), a provider of highly integrated power management, AC/DC power conversion, solid state lighting (SSL) and Bluetooth®…

March 15, 2016

GLOBALFOUNDRIES Broadens SiGe Power Amplifier Portfolio, Enhancing RF Performance and Efficiency for Wireless Devices

Santa Clara, Calif., March 15, 2016 – GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power…

March 15, 2016

Cadence Announces Availability of Complete IC Packaging Design and Analysis Solutions for Advanced Fan-Out Wafer-Level Chip Scale Packaging

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its DDR4 and LPDDR4 IP products for TSMC’s 16nm FinFET Plus (16FF+) process have completed TSMC9000 Silicon…

March 15, 2016

ADLINK Introduces AmITX-SL-G Embedded Board with 6th Generation Intel® Core™ Processor

San Jose, CA – March 15, 2016 – ADLINK Technology, Inc., a leading global provider of cloud- based services, intelligent gateways, and embedded building blocks…

March 15, 2016

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