Archives: News
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Imec and Ghent University Demonstrate First Laser Arrays Monolithically Grown on 300mm Silicon Wafers
Leuven and Ghent (Belgium)—October 29, 2015—Imec and Ghent University present, for the first time, arrays of indium phosphide lasers monolithically integrated on 300mm silicon substrates…
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Indium Corporation’s Insight on Solder Preforms to Reduce Voiding in Bottom Termination Components
This brief video, which can be found at www.indium.com/blog/phil-zarrow, features Indium Corporation Technical Support Engineer Derrick Herron as he explains to SMT expert Phil Zarrow, President…
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Fairchild’s USB Type-C Solution is Chosen for Meizu’s New PRO 5 Smartphone
SAN JOSE, Calif. – October 29, 2015 — Fairchild (NASDAQ: FCS), a leading global supplier of high-performance semiconductor solutions, announced today that its FUSB302, from…
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TE Connectivity Announces New Headerless, Small-Profile Pressure Sensor
HAMPTON, Va. October 26, 2015 –TE Connectivity Ltd. (TE), a world leader in connectivity, today announced a new backside compensated, headerless 86BC pressure sensor that provides reliable,…
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Surpassing 100 Production Designs, Synopsys’ IC Compiler II Achieves the Fastest Ramp-up in the Company’s History
Synopsys, Inc. (Nasdaq:SNPS) today announced that its IC Compiler™ II place and route system has been successfully deployed on more than 100 production designs in the…