Archives: News
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ASML ships new TWINSCAN NXT immersion lithography platform, delivering improved performance for volume production at next-generation process nodes
VELDHOVEN, the Netherlands, 29 September 2015 – ASML Holding NV (ASML) today announced the first shipment of its new TWINSCAN™ NXT:1980Di immersion lithography system to support…
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Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R
Indium Corporation’s Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance. Available…
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Synopsys Announces Industry’s First Security IP Solutions for New SHA-3 Cryptographic Hash Standard
Synopsys, Inc. (Nasdaq:SNPS) has announced the industry’s first security IP solutions compliant to the Secure Hash Algorithm-3 (SHA-3) cryptographic standard from the National Institute of…
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3D Systems Supports “Inspired Minds” Education Program at TCT + Personalize
3D Systems (NYSE:DDD) announced today that, for the third consecutive year, it is supporting the Inspired Minds education program at TCT + Personalize, to be held in…
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TSMC Recognizes Synopsys with Partner Awards for Interface IP and Joint Development of 10-nm FinFET Design Infrastructure
Synopsys, Inc. (Nasdaq: SNPS), today announced that TSMC is recognizing Synopsys with two “2015 Partner of the Year” awards for Interface IP and Joint Development…
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Identiv Releases Connected IOT Premises Access Control Solution With Its Global Partners
FREMONT, Calif., Sept. 28, 2015 (GLOBE NEWSWIRE) — Identiv, Inc. (NASDAQ:INVE) today announced the launch of the Identiv Connected Physical Access Manager (ICPAM) solution. ICPAM is…
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NeoPhotonics Announces Suite of Products to Support 400G Coherent Transport for Long Haul, Metro and Data Center Interconnect Networks
Valencia, Spain – September 28, 2015 – NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of hybrid photonic integrated circuit based modules and subsystems for…