Archives: News
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Cadence Strengthens Allegro Technology Portfolio To Make Design Cycles Shorter and More Predictable
SAN JOSE, Calif., May 20, 2015?Cadence Design Systems, Inc. (NASDAQ: CDNS), today unveiled the Allegro® 16.6 portfolio, which features several new products and technologies. Included…
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Quantum Materials to Announce New Class of High-Reliability Quantum Dots at SID Display Week 2015
SAN MARCOS, Texas, May 20, 2015 (GLOBE NEWSWIRE) — Leading North American quantum dot manufacturer Quantum Materials Corp (OTCQB:QTMM) today announced plans to introduce a new class…
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Real Intent Delivers Major Innovation in Clock Domain Crossing Sign-off of SoC Designs
SUNNYVALE, Calif. – May 21, 2015 – Real Intent, Inc., a leading provider of SoC and FPGA sign-off verification solutions, today announced Meridian Physical CDC – a new tool…
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HeliaFilm® on concrete façade
Herne, Germany – 19th of May 2015 — Europe´s first solar concrete wall was inaugurated today at RECKLI’s headquarter in Herne, Germany. The façade, designed by RECKLI…
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Agnisys Unveils Software to Automate Register Verification Process for SoC, IP, FPGA Designs
Lowell, MA. May 21, 2015 – Agnisys, Inc. announces immediate availability of ARV™ – Automatic Register Verification, an add-on product to IDesignSpec™, that enhances an…
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Applied Materials’ Breakthrough Patterning Hardmask Enables Copper Interconnect Scaling
SANTA CLARA, Calif., May 19, 2015 – Applied Materials, Inc. today announced its Applied Endura® Cirrus HTX PVD* system with breakthrough technology for patterning copper…
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Synopsys Announces Industry’s Lowest Power PCI Express 3.1 IP Solution for Mobile SoCs
MOUNTAIN VIEW, Calif., May 21, 2015 /PRNewswire/ — Highlights: Power management features such as L1 sub-states and use of power gating, power islands and retention cells cut…
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Imec and Tokyo Electron Demonstrate Electrical Advantages of Direct Cu Etch Scheme for Advanced Interconnects
IEEE IITC, Grenoble, (France) – May 20, 2015 – Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented…