News – Page 1568 – EEJournal

Register for DVCon 2015 Today!

Louisville, CO – February 2, 2015 – Not to be missed, the 2015 Design and Verification Conference (DVCon) offers the industry’s most comprehensive technical program focused on…

February 2, 2015

The Quest for Efficiency in Thermoelectric Nanowires

ALBUQUERQUE, N.M. — Efficiency is big in the tiny world of thermoelectric nanowires. Researchers at Sandia National Laboratories say better materials and manufacturing techniques for…

February 2, 2015

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography

SPIE Advanced Lithography 2015 will highlight critical technologies including EUV and 3D integration in transistor scaling, and strategies for managing and maximizing the Internet of…

January 30, 2015

Allegro MicroSystems, LLC Announces New Multiple-Output Regulator For Automotive LCD Displays

Worcester, MA – January 29, 2015 – Allegro MicroSystems, LLC announces a new AEC-Q100 qualified, multiple-output regulator for powering automotive LCD displays. Allegro’s A8603 operates with fixed switching…

January 30, 2015

TE Connectivity’s Revolutionary New ARISO Contactless Connectivity System Now Available from Mouser

January 30, 2015- Mouser Electronics, Inc. is now stocking the new, revolutionary ARISO Contactless Connectivity system from TE Connectivity (TE), a world leader in connectivity, that allows power and data…

January 30, 2015

Synopsys’ New DesignWare Medium Density NVM IP Family Reduces Die Cost by Up to 25 Percent

MOUNTAIN VIEW, Calif., Jan. 29, 2015 /PRNewswire/ — Highlights: Reprogrammable DesignWare Medium Density NVM IP delivers flash-like functionality without additional masks or processing steps, reducing die cost…

January 29, 2015

512Kbyte STM32F3 MCUs from STMicroelectronics Raise the Bar in System Integration

Geneva, January 29, 2015 – STMicroelectronics has extended its STM32F3 microcontroller series for applications that require high performance and innovative features at affordable cost. The new devices add larger memory…

January 29, 2015

Bluetooth Smart mesh network lighting platform claims to be 5x faster than competing solutions by combining Bluetooth Smart and proprietary 2.4GHz

Developed by Finnish lighting specialist, Casambi, this award-winning third-party platform based on the dual-protocol Nordic nRF51822 SoC is designed to bring smart lighting to mainstream…

January 29, 2015

New Artesyn Embedded Technologies Compact ATCA System Platform Offers Highest Power and Cooling Performance

Artesyn Embedded Technologies today announced the Centellis® 2100, a two-slot 40G AdvancedTCA® (ATCA®) system platform designed to support the latest high performance payload blades. With power and cooling support…

January 28, 2015

PAM4 Analysis, USB 3.1 Compliance, DDR Debug, PCI Express Link Equalization, and 100 GHz Oscilloscope Capabilities Showcased at DesignCon 2015

Chestnut Ridge, NY and Santa Clara, CA, January 28, 2015 – Teledyne LeCroy, a longtime Diamond Sponsor of DesignCon, will once again be showcasing the…

January 28, 2015

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