News – Page 1619 – EEJournal

Microsemi Expands Customer Application Design Opportunities by Introducing SmartFusion2 Advanced Development Kit with Largest Density 150K LE Device

ALISO VIEJO, Calif.—Sept. 29, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the…

September 29, 2014

Cadence and ARM Expand System-on-Chip Design Collaboration with New Multi-Year Technology Access Agreement

Highlights: Multi-year Technology Access Agreement gives Cadence rights to access to existing and future ARM® Cortex® processors, ARM Mali(TM) GPUs, ARM CoreLink(TM) system IP, ARM…

September 29, 2014

S2C Announces AXI-4 Prototype Ready Quick Start Kit

SAN JOSE, Calif. – Sept. 29, 2014 – S2C, Inc. announced today the release of its AXI-4 Prototype Ready™ Quick Start Kit, based on the…

September 29, 2014

Eurotech Announces Release of Kura 1.0 Java-OSGi Framework for M2M Gateways and Smart Sensor

AMARO, September 26, 2014 – Eurotech, a leading supplier of embedded technologies, products and systems, announced the official release of Kura 1.0, the Java OSGi software framework for…

September 26, 2014

Versatile Media Isolated Pressure Sensor from Measurement Specialties Withstands Extremely Corrosive Environments

Hampton, Va. September 2014 – Measurement Specialties (NASDAQ: MEAS), an expert in sensor design and manufacturing, has now expanded its 154 Series of media isolated, piezoresistive silicon pressure…

September 26, 2014

VadaTech Offers Hybrid 2U MicroTCA Chassis Platform with Rear Transition Slots

Henderson, NV – Sept 25, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, has announced a 2U Hybrid Chassis that provides…

September 26, 2014

High-Speed 5 GS/s PCIe Digitizer Cards released by Spectrum

Grosshansdorf, Germany — September 26th, 2014 — For the first time, Spectrum is offering a solution to engineers and scientists looking to capture and analyze fast electronic signals…

September 26, 2014

Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process

SAN JOSE, Calif., September 26, 2014 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that its digital and custom/analog…

September 26, 2014

Tiny Balun-on-a-Chip from STMicroelectronics Simplifies Bluetooth Smart® Design

Geneva, September 22, 2014 – Designers building Bluetooth Smart® devices or modules can accelerate project completion, maximize system performance, and minimize solution size using STMicroelectronics’ new integrated…

September 25, 2014

Valencell Opens New State of the Art Sports Testing Lab to Support the Development and Validation of Highly Accurate, Precise Biometric Wearables

RALEIGH, N.C., Sept. 23, 2014 /PRNewswire/ — Valencell, <http://valencell.com/> an expert and pioneer in precision biometric data sensor technology, has opened a new, state of…

September 25, 2014

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